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| Investment in additional R&D Capabilities in Europe and Asia | To satisfy the growing global demand for current a... | 12075 | Industry News | Investment in additional R&D Capabilities in Europe and Asia | To satisfy the growing global demand for current and voltage sensing driven by the push towards decarbonization and greater electrification, LEM has opened new research and development facilities in Munich and Shanghai. The two sites are said to enable LEM to build greater intelligence into its sensors and to have development bases closer to key customers, while also promoting deeper collaboration on projects and the efficient sharing of vital product design information. While the China site will be kitted out with the very latest laboratory equipment, the site in Germany will focus on ASIC design and semiconductor technology that will help accelerate LEM’s innovation in integrated current sensors (ICSs). This latest investment in additional R&D facilities in Europe and Asia follows on from LEM’s recent inauguration of a factory in Malaysia. LEM’s investment in the state of Penang was an acknowledgment of the region’s expertise in ASIC technology and its specialization in semiconductor design and production. There are already 10 employees in place at Munich and this number will increase in line with LEM’s growth plans for the site. At the 1400 m² Shanghai facility, there are currently 30 staff with the capacity to more than double that number in the future, many of whom will be involved in R&D. | 23.08.2024 11:00:00 | Aug | news_2024-09-01_6.jpg | \images\news_2024-09-01_6.jpg | https://www.lem.com/en | lem.com |
| Ideal Diodes in small TSSPs | Nexperia has introduced two ideal power diode ICs.... | 12086 | Product Release | Ideal Diodes in small TSSPs | Nexperia has introduced two ideal power diode ICs. The NID5100 is suitable for standard industrial and consumer applications while the NID5100-Q100 has been qualified for use in automotive applications. Ideal diodes are MOSFET-based devices that offer much lower forward voltage drop than traditional diodes and make a good replacement option to standard diodes in systems where power efficiency is paramount. The NID5100 and NID5100-Q100 ideal diodes are available in small TSSP6/SOT363-2 leaded plastic packages measuring 2.1 mm x 1.25 mm x 0.95 mm. Applications that can benefit from their electrical performance include smart meters, fire/security sensors, battery powered wearables, and automotive telematics units. The NID5100 is a PMOS based ideal diode where the gate voltage of an internal MOSFET regulates the anode-to-cathode voltage to be eight to ten times lower than the forward voltage drop of similarly rated Schottky diodes. Besides the low forward drop, the MOSFET-based ideal diode also helps to reduce reverse DC leakage current by up to 100 times compared to a typical Schottky diode. The NID5100 supports "OR-ing" multiple power supplies while retaining reverse polarity protection and provides ultra-fast response time for smooth power transfer. Its forward regulation voltage is 31 mV with forward currents up to 1.5 A. | 22.08.2024 12:30:00 | Aug | news_2024-09-01_17.jpg | \images\news_2024-09-01_17.jpg | https://assets.nexperia.com/documents/data-sheet/NID5100.pdf | nexperia.com |
| MOSFETs in SMD Package for High Performance Applications | Alpha and Omega Semiconductor has announced Power ... | 12089 | Product Release | MOSFETs in SMD Package for High Performance Applications | Alpha and Omega Semiconductor has announced Power MOSFETs in LFPAK 5x6 packages for voltages of 40 V (AOLF66412, AOLF66413 and AOLF66417), 60 V (AOLF66610), and 100 V (AOLF66910). The devices are designed to withstand harsh environments while maintaining MOSFET performance in applications such as industrial, server power, telecommunications, and solar, where high reliability is required. The LFPAK packaging enables higher board-level reliability due to key packaging features such as gull-wing leads, which offer a ruggedized solution for board-level environmental stresses. The gull-wing leads also enable optical inspection during PCB manufacturing. Another feature enhancement is the LFPAK's larger copper clip, which improves electrical and thermal performance. Advantages of the large clip include improved current handling capabilities, reduced on-resistance, and better heat dispersion compared to wire bonding. A large clip also has low parasitic inductance, enabling lower spike voltage in switching applications. The devices operate with gate-source voltages of ±20 V at maximum junction temperatures of 175 °C. The drain current @ 25 °C and the maximum R<sub>DS(on)</sub> both depend on the model ranging from 187 to 294 A or, respectively, 1.5 to 4.7 mΩ at a gate-source voltage of 10 V. | 21.08.2024 15:30:00 | Aug | news_2024-09-01_20.jpg | \images\news_2024-09-01_20.jpg | https://www.aosmd.com/sites/default/files/2024-08/AOS_LFPAK_PR_1.pdf | aosmd.com |
| Industrial AC/DC Power Supplies in 2" x 3" Packages | Traco Power released its TXO family of 45, 60 & 12... | 12088 | Product Release | Industrial AC/DC Power Supplies in 2" x 3" Packages | Traco Power released its TXO family of 45, 60 & 120 W compact AC/DC Power supplies. These are the first 3 power levels of a TXO family of power supplies that will eventually go to 500 W. The TXO line specifically focuses on providing cost-efficient industrial power supplies. Efficiencies of up to 92 % allow for a compact design, and these models are designed to meet the ErP directive (< 0.3 W no load power consumption). Features include an internal EN55032 class B filter, as well as EMC characteristics dedicated for applications in industrial/automation and test & measurement fields. Basic features include a 2" x 3" open-frame construction, a universal input range of 85 – 264 VAC, 3000 VAC reinforced I/O isolation, an internal EN55032 class B filter, short circuit and overvoltage protection, IEC/EN/UL 62368-1 safety approvals and EN 61000-3-2 compliance. The TXO 45/60 series operates at full load convection cooled in the range of -20 °C to +50 °C, while the TXO 120 series operates as follows: 100 W convection / 120 W forced air -20 °C to +50 °C. | 20.08.2024 14:30:00 | Aug | news_2024-09-01_19.jpg | \images\news_2024-09-01_19.jpg | https://www.tracopower.com/de/txo | tracopower.com |
| Online EV-Charging Resource Hub | Arrow Electronics has developed and launched a res... | 12077 | Industry News | Online EV-Charging Resource Hub | Arrow Electronics has developed and launched a resource for EV charging for the automotive industry. Expanding its library of content, Arrow helps engineers developing the next generation of electric vehicle chargers and the corresponding software ecosystem that supports them. The hub offers design and technical support across the three electric vehicle charger categories: on-board charger, AC chargers and DC (or fast) chargers. Among the resources now available, Arrow has introduced a free eBook that delves into the latest developments in EV charging, such as costs, adapters, and the economic advantages of electric vehicles. There are also webinars available on-demand, including "Trends and Technologies for Next-Gen EV Charging Solutions". | 19.08.2024 13:00:00 | Aug | news_2024-09-01_8.jpg | \images\news_2024-09-01_8.jpg | https://www.arrow.com/en/ev-charging-solutions | arrow.com |
| eBook about Connectivity Needs and Technologies for Connected Homes | Mouser Electronics has released an eBook in collab... | 12076 | Industry News | eBook about Connectivity Needs and Technologies for Connected Homes | Mouser Electronics has released an eBook in collaboration with Qorvo, offering a detailed look at the connectivity requirements for smart homes and the different technologies used to support them. In Next-Gen Connectivity for Smart Living, experts from Mouser and Qorvo offer a deep dive into the technologies that underpin connectivity for smart homes, including Wi-Fi 7, ultra-wideband, and IoT standards like Zigbee, Thread, and Bluetooth Low Energy. The eBook features six different articles, each of which includes detailed infographics and links to relevant design tips from Qorvo including links to a dozen recommended Qorvo products. | 19.08.2024 12:00:00 | Aug | news_2024-09-01_7.jpg | \images\news_2024-09-01_7.jpg | https://resources.mouser.com/manufacturer-ebooks/qorvo-next-gen-connectivity-for-smart-living | mouser.com |
| Funding of up to $1.6 Billion in CHIPS and Science Act | Texas Instruments (TI) and the U.S. Department of ... | 12074 | Industry News | Funding of up to $1.6 Billion in CHIPS and Science Act | Texas Instruments (TI) and the U.S. Department of Commerce have signed a non-binding Preliminary Memorandum of Terms for up to $1.6 billion in proposed direct funding under the CHIPS and Science Act to support three 300 mm wafer fabs already under construction in Texas and Utah. In addition, TI expects to receive an estimated $6 billion to $8 billion from the U.S. Department of Treasury's Investment Tax Credit for qualified U.S. manufacturing investments. The proposed direct funding, coupled with the investment tax credit, would help TI provide a geopolitically dependable supply of essential analog and embedded processing semiconductors. The proposed direct funding under the CHIPS Act would support TI's investment of more than $18 billion through 2029, which is part of the company's broader investment in manufacturing. This proposed direct funding will support three new wafer fabs, two in Sherman, Texas, (SM1 and SM2) and one in Lehi, Utah (LFAB2), specifically to construct and build the SM1 cleanroom and complete pilot line for first production, to construct and build the LFAB2 cleanroom for first production and to construct the SM2 shell. They will produce semiconductors in 28 nm to 130 nm technology nodes. | 16.08.2024 10:00:00 | Aug | news_2024-09-01_5.jpg | \images\news_2024-09-01_5.jpg | https://news.ti.com/2024-08-16-Texas-Instruments-signs-preliminary-agreement-to-receive-up-to-1-6-billion-in-CHIPS-and-Science-Act-proposed-funding-for-semiconductor-manufacturing-in-Texas-and-Utah | ti.com |
| Call for Papers for the 75th ECTC | The IEEE Electronic Components and Technology Conf... | 12071 | Event News | Call for Papers for the 75th ECTC | The IEEE Electronic Components and Technology Conference (ECTC), a major technical conference and product exhibition for the world's semiconductor packaging industry, has announced a Call for Papers for ECTC 2025, the conference's 75th anniversary. The 75th annual ECTC will take place May 27-30, 2025 at the Gaylord Texan Resort & Convention Center in Dallas. More than 2,000 scientists, engineers and business people from more than 20 countries are expected to attend. Abstract submission has already been opened and the deadline for submissions is October 7, 2024. The ECTC 2025 technical program will address new developments, trends and applications for a broad range of topics, including components, materials, assembly, reliability, modeling, interconnect design and technology, device and system packaging, heterogeneous integration, wafer level packaging, photonics and optoelectronics, IoT, 5G, quantum computing and systems, 2.5D and 3D integration technology, and other emerging technologies in electronics packaging. | 16.08.2024 07:00:00 | Aug | news_2024-09-01_2.jpg | \images\news_2024-09-01_2.jpg | https://www.ectc.net/abstracts/75thCallforPapers-Web.pdf | ectc.net |
| High-Performance Power Module Family | SemiQ has added an S7 package to its QSiC™ f... | 12087 | Product Release | High-Performance Power Module Family | SemiQ has added an S7 package to its QSiC™ family of 1200 V, half-bridge MOSFET and Schottky diode SiC power modules. The parts enhance design flexibility for power engineers by providing compact, high-efficiency, high-performance options for new designs while supporting drop-in-replacement in legacy systems that require more efficient operation. This latest announcement sees the availability of a 529A MOSFET module (GCMX003A120S7B1: RdsOn 3.0 mΩ, B1 package), a 348A MOSFET module (GCMX005A120S7B1: R<sub>dsOn</sub> 4,9 mΩ, B1 package), and two low-noise SiC Schottky diode half-bridge modules (GHXS300A120S7D5 for 300 A and GHXS400A120S7D5 for 400 A) in an S7 package with industry-standard 62.0 mm footprints and a height of 17.0 mm. The package addresses the size, weight and power requirements of demanding applications ranging from induction heaters, welding equipment and uninterruptible power supplies (UPS) to photovoltaic and wind inverters, energy storage systems, high-voltage DC-DC converters and battery charging systems for electric vehicles (EVs). To guarantee a stable gate threshold voltage and premium gate oxide quality for each module, SemiQ conducts gate burn-in testing at the wafer level and performs various stress. All parts have undergone testing surpassing 1400 V. | 14.08.2024 13:30:00 | Aug | news_2024-09-01_18.jpg | \images\news_2024-09-01_18.jpg | https://semiq.com/module-packages | semiq.com |
| New Semiconductor Material: AlYN promises more Energy-Efficiency | Researchers at Fraunhofer IAF (Fraunhofer Institut... | 12073 | Industry News | New Semiconductor Material: AlYN promises more Energy-Efficiency | Researchers at Fraunhofer IAF (Fraunhofer Institute for Applied Solid State Physics) have reported that they "made a breakthrough in the field of semiconductor materials": With Aluminum Yttrium Nitride (AlYN), they have succeeded in fabricating and characterizing a new and promising semiconductor material using the MOCVD process. Due to its excellent material properties and its adaptability to gallium nitride (GaN), AlYN is said to have "enormous potential for use in energy-efficient high-frequency and high-performance electronics for information and communications technology". AlYN shows outstanding material properties, however, the growth of the material has been a major challenge. Until now, AlYN could only be deposited by magnetron sputtering. Researchers at Fraunhofer IAF have now succeeded in fabricating the new material using metal-organic chemical vapor deposition (MOCVD) technology, thus enabling the development of new, diverse applications. The institute thinks that "with its promising material properties, AlYN could become a key material for future technological innovations". Recent research had already demonstrated the material properties of AlYN, such as ferroelectricity. In developing the new compound semiconductor, the researchers at Fraunhofer IAF focused primarily on its adaptability to gallium nitride (GaN) – especially in terms of the lattice structure. | 14.08.2024 09:00:00 | Aug | news_2024-09-01_4.jpg | \images\news_2024-09-01_4.jpg | https://www.iaf.fraunhofer.de/en/media-library/press-releases/new-semiconductor-material-AlYN.html | iaf.fraunhofer.de |
| AC Surge Protective Devices | Bourns' Model 1270 and 1280 Series Din-Rail AC Sur... | 12080 | Product Release | AC Surge Protective Devices | Bourns' Model 1270 and 1280 Series Din-Rail AC Surge Protective Devices (SPDs) are IEC/EN 61643-11 compliant Class I + Class II / T1+T2 SPDs, and Model 1280 features an Advanced Thermal Disconnector (TD+) for enhanced protection that eliminates the need for upstream overcurrent protection. Both model series also feature a window fault indicator and remote alarm to help monitor the operating status of the surge protector. In addition, Bourns announced its Model 1430 and 1440 Series Din-Rail DC Surge Protective Devices (SPDs). The two series are IEC/EN 61643-31 compliant Class I + Class II / T1+T2 SPDs. Designed to protect DC power systems, the 14 new models offer protection voltage ranging from 48 VDC up to 1500 VDC and feature high energy MOV technology. In addition, the Model 1440 Series features an Advanced Thermal Disconnector (TD+) as well. Both model series have a replaceable modular design, and also include a window fault indicator and remote alarm, providing enhanced surge protector operating status monitoring. | 14.08.2024 06:30:00 | Aug | news_2024-09-01_11.jpg | \images\news_2024-09-01_11.jpg | http://www.bourns.com/products/surge-protective-devices/dc-power-surge-protective-devices | bourns.com |
| Power Factor Correction Chokes für up to 3,300 W | ITG Electronics has expanded its portfolio of powe... | 12083 | Product Release | Power Factor Correction Chokes für up to 3,300 W | ITG Electronics has expanded its portfolio of power factor correction chokes (PFCs) with a set of solutions designed for high switching frequencies. Capable of handling up to 3,300 W the company's PFC433835B Series include CCM PFC boost converters with switching frequencies from 100 – 200 kHz. An extension of ITG Electronics' Cubic Design set of power factor correction chokes, PFC433835B Series solutions are suitable for Inductance ranges from 90 – 285 µH and have footprints up to 43 mm x 35 mm and maximum heights of 38 mm. Compared with traditional toroidal-shaped PFC chokes, the PFC433835B Series features a flat wire and square core construction to save space and increase power density. The solutions are said to be up to 50% smaller compared with toroidal-shaped PFC chokes with similar power ratings, and their flat wire technology can reduce DC resistance by as much as 40%, leading to substantially lower copper losses. | 13.08.2024 09:30:00 | Aug | news_2024-09-01_14.jpg | \images\news_2024-09-01_14.jpg | https://itg-electronics.com/en/series/914 | itg-electronics.com |
| DC/DC Buck Converter deliver up to 20 A | TDK Corporation expanded its TDK-Lambda i7A series... | 12082 | Product Release | DC/DC Buck Converter deliver up to 20 A | TDK Corporation expanded its TDK-Lambda i7A series of non-isolated buck (step-down) DC/DC converters with the industry-standard 1/16th brick pinout. 20 A output models with a 500 W maximum rating are now available, offering a trimmable 3.3 – 32 V output capability and operation from 28 V up to 60 V input. An adjustable over-current limit is also available as an option, reducing stress on the converter or load when exposed to excessive overcurrent conditions and facilitating fine-tuning based on actual system requirements. The 20A i7A models can be used to derive additional high-power outputs at higher efficiency than isolated DC-DC converters. These products are suited for use in mobile robotics, drones, medical, industrial, test and measurement, communications, computing, and portable battery-powered equipment. Efficiencies of up to 96% minimize internal losses and allow the 20 A i7A models to operate in ambient temperatures of -40 °C up to +125 °C, even with low airflow conditions. The i7A's design provides low output ripple and excellent response to dynamic loads. All models have safety certification to the IEC/UL/CSA/EN 62368-1 standards, with CE and UKCA marking to the Low Voltage and RoHS Directives. | 13.08.2024 08:30:00 | Aug | news_2024-09-01_13.jpg | \images\news_2024-09-01_13.jpg | https://product.tdk.com/system/files/dam/doc/product/power/switching-power/dc-dc-converter/catalog/i7a_e.pdf | tdk.com |
| Intelligent Power Module for Industrial Motors up to 4 kW | Infineon Technologies expands its 7th generation T... | 12081 | Product Release | Intelligent Power Module for Industrial Motors up to 4 kW | Infineon Technologies expands its 7th generation TRENCHSTOP™ IGBT7 product family with the CIPOS™ Maxi Intelligent Power Module (IPM) series for low-power motor drives. The IM12BxxxC1 series is based on the TRENCHSTOP IGBT7 1200 V and rapid diode EmCon 7 technology. Thanks to the latest micro-pattern trench design, it offers exceptional control and performance. This results in significant loss reduction, increased efficiency, and higher power density. The portfolio includes three new products in variants ranging from 10 A to 20 A for power ratings of up to 4.0 kW: IM12B10CC1, IM12B15CC1 and IM12B20EC1. The IM12BxxxC1 series is packaged in a DIP 36x23D housing. It integrates various power and control components. This makes it "the smallest package for 1200 V IPMs with the highest power density and best performance in its class", the company says. The IM12BxxxC1 series is particularly suitable for low-power drives in applications such as motors, pumps, fans, heat pumps and outdoor fans for heating, ventilation, and air conditioning. The IPM series offers an isolated dual-in-line molded housing also meets the EMI and overload protection requirements of demanding designs. In addition to the protection features, the IPM is equipped with an independent UL-certified temperature thermistor. | 12.08.2024 07:30:00 | Aug | news_2024-09-01_12.jpg | \images\news_2024-09-01_12.jpg | https://www.infineon.com/cms/en/about-infineon/press/market-news/2024/INFGIP202408-135.html | infineon.com |
| Connect with the Advanced Battery and Electric & Hybrid Vehicle Technology Community | Join North America's largest advanced battery even... | 12079 | Event News | Connect with the Advanced Battery and Electric & Hybrid Vehicle Technology Community | Join North America's largest advanced battery event, The Battery Show and Electric & Hybrid Vehicle Technology Expo, October 7-10, 2024, at Huntington Place, Detroit. Discover the latest technologies and solutions from over 1,150 exhibitors including industry heavy hitters such as Dow, Parker, Hongfa America, Henkel, Honeywell, Siemens, Ampherr, Sabic, Trumpf and more across multiple sectors including automotive stationary, medical, aerospace, commercial, and industrial applications. Experience live product showcases and visit Pavilions on the show floor, including the new Lead and Recycling Pavilions, for industry-specific innovations. Enhance your knowledge with free educational sessions at the Battery Tech Theatre and Open Tech Forum. For a deeper dive, upgrade to our five-track conference covering advanced battery design, manufacturing, market forecasts, and regulatory trends. Network with over 19,000 professionals in the advanced battery and H/EV community through various expo events. Don't miss the ''Welcome to Detroit: An Electrifying Evening in the Motor City" where we celebrate the new home of The Battery Show and Electric & Hybrid Vehicle Technology Expo in Downtown Detroit. We can't wait to see you there! Register now to secure your FREE expo pass or enjoy a $100 discount on conference passes with code BOD. | 10.08.2024 15:00:00 | Aug | news_2024-09-01_10.jpg | \images\news_2024-09-01_10.jpg | https://register.thebatteryshow.com/37t67i | thebatteryshow.com |
| Automotive DC/DC Converters with "highest Power Density" | Vitesco Technologies created a new generation of D... | 12078 | Industry News | Automotive DC/DC Converters with "highest Power Density" | Vitesco Technologies created a new generation of DC/DC converters that are claimed to “set new standards in power density (efficiency of over 96 percent) and sustainability for power grids, power supplies, and OBC (On-Board Chargers)”. For this design Vitesco has selected the CoolGaN™ Transistors 650 V from Infineon. With GaN Transistors, Vitesco Technlogies was able to design its Gen5+ GaN Air DC/DC converters with passive cooling, which reduces the system's overall cost. The GaN devices also allow for simplified converter design and mechanical integration. As a result, the DC/DC converters can be flexibly positioned in the vehicle, reducing the workload for manufacturers. The use of GaN also allows the power of the converters to be scaled up to 3.6 kW and the power density to be increased to over 4.2 kW/l. The Gen5+ GaN Air DC/DC converters offer an efficiency of over 96 percent and improved thermal behavior compared to the Gen5 Liquid-Cooled converters. They provide a two-phase output of 248 A at 14.5 V continuous. The phases can be combined to achieve the maximum output power. Still, it is also possible to switch off one phase under partial load conditions and interleave the switching frequency between the two phases. | 09.08.2024 14:00:00 | Aug | news_2024-09-01_9.jpg | \images\news_2024-09-01_9.jpg | https://www.infineon.com/cms/en/about-infineon/press/market-news/2024/INFPSS202408-134.html | infineon.com |
| Personnel Change in Executive Board | Peter Riedel has decided to resign from his positi... | 12072 | People | Personnel Change in Executive Board | Peter Riedel has decided to resign from his position as President and COO of Rohde & Schwarz for personal reasons, and he has already left the company, however, he will remain associated with Rohde & Schwarz in an advisory role. After the departure of Peter Riedel, the Executive Board of the Munich technology company now consists of Christian Leicher as President and Chief Executive Officer and CTO Andreas Pauly. For the time being, Andreas Pauly will assume the tasks of Chief Operating Officer on an interim basis. Peter Riedel had been on the Executive Board as Chief Operating Officer since 2014. | 08.08.2024 08:00:00 | Aug | news_2024-09-01_3.jpg | \images\news_2024-09-01_3.jpg | https://www.rohde-schwarz.com/uk/about/news-press/all-news/personnel-change-to-the-rohde-schwarz-executive-board-press-release-detailpage_229356-1512599.html?change_c=true | rohde-schwarz.com |
| SiC Power Semiconductor Fab in Malaysia | As global decarbonization efforts drive demand for... | 12070 | Industry News | SiC Power Semiconductor Fab in Malaysia | As global decarbonization efforts drive demand for power semiconductors, Infineon Technologies has officially opened the first phase of a new fab in Malaysia that will become the world's largest and most competitive 200-millimeter silicon carbide (SiC) power semiconductor fab. Malaysian Prime Minister YAB Dato' Seri Anwar Ibrahim and Chief Minister of the state of Kedah YAB Dato' Seri Haji Muhammad Sanusi Haji Mohd Nor joined Infineon CEO Jochen Hanebeck, to symbolically launch production. The highly efficient 200-millimeter SiC power fab will strengthen Infineon's role as the global leader in power semiconductors. The first phase of the fab, with an investment volume of two billion euros, will focus on the production of silicon carbide power semiconductors and will include gallium nitride (GaN) epitaxy. SiC semiconductors have revolutionized high-power applications because they switch electricity even more efficiently and enable even smaller designs. SiC semiconductors increase efficiency in electric vehicles, fast charging stations and trains as well as renewable energy systems and AI data centers. 900 high-value jobs will be created already in the first phase. The second phase, with an investment of up to five billion euros, will create the world's largest and most efficient 200-millimeter SiC power fab. Overall, up to 4.000 jobs will be created with the project. | 08.08.2024 06:00:00 | Aug | news_2024-09-01_1.jpg | \images\news_2024-09-01_1.jpg | https://www.infineon.com/cms/en/about-infineon/press/press-releases/2024/INFXX202408-133.html | infineon.com |
| Electric Vehicle Charger Reference Designs | To accelerate the time to market of an EV charger,... | 12085 | Product Release | Electric Vehicle Charger Reference Designs | To accelerate the time to market of an EV charger, Microchip Technology now offers three flexible and scalable EV Charger Reference Designs including a Single-Phase AC Residential, a Three-Phase AC Commercial (up to 22 kW) with Open Charge Point Protocol (OCPP) and System-on-Chip (SoC) and a Three-Phase AC Commercial with OCPP and Display. Most of the active components for the EV charger reference designs are available from Microchip, including the microcontroller (MCU), analog front-end, memory, connectivity and power conversion. This significantly streamlines the integration process, enabling manufacturers to speed time to market for new charging solutions. These reference designs offer complete hardware design files and source code with software stacks that are tested and compliant to communication protocols, including OCPP. OCPP offers manufacturers a standard protocol to communicate between the charge point or charging station and a central system. This protocol is designed to enable interoperability of the charging applications regardless of the network or vendor. The EV Reference Designs are supported by MPLAB X Integrated Development Environment (IDE) to help designers minimize development time, as well as MPLAB Harmony v3 and MPLAB Code Configurator. | 07.08.2024 11:30:00 | Aug | news_2024-09-01_16.jpg | \images\news_2024-09-01_16.jpg | https://www.microchip.com/en-us/solutions/automotive-and-transportation/charging-station/ev-offboard-ac-charger-reference-designs | microchip.com |
| Series of Wire-Wound Ferrites extended | Würth Elektronik now offers its WE-RFI inductors i... | 12084 | Product Release | Series of Wire-Wound Ferrites extended | Würth Elektronik now offers its WE-RFI inductors in sizes 0402 and 0603, which can be used as inductors for RF applications or as ferrites for interference suppression. Here the manufacturer responds to increasing miniaturization and complements the existing sizes 0805 and 1008. The components are suitable as low-pass filters (for filtering high-frequency noise), data line filters, supply voltage decoupling, low-frequency radio applications, and RFID. As wire-wound ferrites, the WE-RFI inductors attain higher impedances than normal ferrites, even at high frequencies, and over a wider bandwidth. Unlike multilayer ferrites, they show no DC bias behavior. As RF inductors, they offer high inductance values from 20 nH up to 47 µH. They are characterized by low RDC and consequently a high rated current of up to 1.91 A at ΔT = 40 K. A design kit is available for this component group, which Würth Elektronik will always replenish free of charge, so developers always have inductances of different values to hand. | 07.08.2024 10:30:00 | Aug | news_2024-09-01_15.jpg | \images\news_2024-09-01_15.jpg | https://www.we-online.com/en/news-center/press?instance_ID=5506&d=we-rfi | we-online.com |
| High-Power Semiconductor Company: President Change | Dominic Dorfner will take over as president Semikr... | 12056 | People | High-Power Semiconductor Company: President Change | Dominic Dorfner will take over as president Semikron Danfoss, when Claus A. Petersen retires on August 31, after 40 years in the Danfoss Group. He has been leading Danfoss Silicon Power and Semikron Danfoss for the last 26 years. Dominic Dorfner has been named new president of the company and will start working in his new position on September 1, 2024. He joined Semikron Danfoss in 2021 as head of the industry business in Danfoss Silicon Power, and for the past 13 months he has been leading the automotive division in Semikron Danfoss. Though now retiring as company president, Claus A. Petersen is not completely leaving Semikron Danfoss, as he has joined the board of directors. | 07.08.2024 07:00:00 | Aug | news_2024-08-15_2.jpg | \images\news_2024-08-15_2.jpg | https://www.semikron-danfoss.com/about-semikron-danfoss/news-press/detail/claus-a-petersen-retiring-from-semikron-danfoss-and-has-joined-the-board-of-directors-dominic-dorfner-named-new-president.html | semikron-danfoss.com |
| President of Energy Business | Effective from the beginning of August 2024, Per E... | 12059 | People | President of Energy Business | Effective from the beginning of August 2024, Per Erik Holsten is the president of ABB Energy Industries. He moves into the role from the position of hub manager for Northern Europe at ABB Energy Industries. Per Erik succeeds Brandon Spencer, who has become president of the ABB Motion business area. Per Erik offers vast experience within the energy sector, from traditional sources through to key energy transition industries including hydrogen, offshore wind and Power-to-X. Per Erik Holsten holds an MBA of International Business from the University of East London, UK. He also studied Engineering at Sør-Trøndelag University College (HiST), Norway. He is based in Oslo, Norway. | 05.08.2024 10:00:00 | Aug | news_2024-08-15_5.jpg | \images\news_2024-08-15_5.jpg | https://new.abb.com/process-automation/energy-industries | abb.com |
| SiC MOSFETs for High-Voltage Drives in EVs | With three half-bridge modules in SiC MOSFET techn... | 12062 | Product Release | SiC MOSFETs for High-Voltage Drives in EVs | With three half-bridge modules in SiC MOSFET technology, the manufacturer StarPower is expanding its range of power semiconductors for use in the drivetrain of electric vehicles. The devices, dubbed MD19HFC120N6HT, MD22HFC120N6HY and MD29HFC120N6HT, are characterized by a blocking voltage (V<sub>DSS</sub>) of 1200 V. This means that the products can be used in environments with an 800 V on-board power supply. The individual models of the MOSFET family differ in their on-resistance (R<sub>DS(ON)</sub>), which covers the range between 1.8 mΩ and a maximum of 2.82 mΩ depending on the type. All models in this product family can be connected in parallel to increase the current. These MOSFETS are supplied in a 2-in-1 housing, which is optimized for low parasitic inductance in order to suppress unwanted oscillation tendencies. Heat loss is dissipated via a solid copper base plate with PINFIN structures for optimum cooling. The ceramic material silicon nitride (S<sub>3</sub>N<sub>4</sub>) is used as the carrier substrate, employing the sophisticated AMB (Active Metal Brazing) process. | 05.08.2024 08:30:00 | Aug | news_2024-08-15_8.jpg | \images\news_2024-08-15_8.jpg | https://www.starpowereurope.com/en/products | starpowereurope.com |
| 32-bit-DSCs with more Peripherals for Power Applications | Microchip has launched its dsPIC33A Core family of... | 12060 | Product Release | 32-bit-DSCs with more Peripherals for Power Applications | Microchip has launched its dsPIC33A Core family of Digital Signal Controllers (DSCs) which well-suited for motor control, power supply, charging and sensing systems. Built around a 32-bit CPU architecture with a 200 MHz operating speed, the DSC family's core includes a Double-Precision Floating-Point Unit (DP FPU) and DSP instructions for numerically intensive tasks in many closed-loop control algorithms. The architecture enables real-time control coupled with a comprehensive development tool ecosystem to streamline and accelerate the design process. The DSCs provide additional math and data processing, higher code efficiency, faster context switching and reduced latency than former members of the family. This allows for a faster response time to transient and safety-critical events. New and upgraded peripherals - such as high-resolution PWMs specifically engineered for motor control and digital power conversion - are designed to support progressive technology development in various markets including automotive, industrial, consumer, E-Mobility, data center and sustainable solutions segments. The dsPIC33A family features integrated analog peripherals, including 12-bit ADCs capable of conversion rates up to 40 Msps, comparators and operational amplifiers. These analog peripherals, in conjunction with Core Independent Peripherals (CIPs), allow for sophisticated sensing and high-performance control. In addition, the CIPs enable interaction among the peripherals without the need for CPU involvement. | 30.07.2024 06:30:00 | Jul | news_2024-08-15_6.jpg | \images\news_2024-08-15_6.jpg | https://www.microchip.com/en-us/about/news-releases/products/microchip-technology-introduces-a-new-core-in-the-dspic | microchip.com |
| High-Current Inductor for Automotive Applications | Würth Elektronik offers WE-LHCA (Low Profile High ... | 12069 | Product Release | High-Current Inductor for Automotive Applications | Würth Elektronik offers WE-LHCA (Low Profile High Current Automotive Inductor) – a particularly flat and temperature-tough inductor in four sizes with different inductance values. The power inductors are designed for an extended temperature range of -55 to +155 °C and are constructed to avoid thermal degradation. The AEC-Q200-certified inductor is suitable for applications such as high-current power supplies, start-stop systems, power distribution modules, on-board chargers, infotainment or HVAC systems. The members of this inductor family are available in the following sizes: 7030 (L = 0.47 - 22 µH), 1040 (L = 1 - 68 µH), 1365 (L = 1 - 47 µH) and 1770 (L = 4.7 - 82 µH). These components feature a low-profile shielded construction with a distributed air gap in iron alloy powder. | 25.07.2024 15:30:00 | Jul | news_2024-08-15_15.jpg | \images\news_2024-08-15_15.jpg | https://www.we-online.com/en/news-center/press?instance_ID=5506&d=we-lhca | we-online.com |
| Aluminum Polymer rectangular Capacitors for 48 V | KEMET's aluminum polymer rectangular capacitors of... | 12068 | Product Release | Aluminum Polymer rectangular Capacitors for 48 V | KEMET's aluminum polymer rectangular capacitors of the APL90 series are now available from Rutronik. The capacitors are AEC-Q200 qualified and are particularly suitable for meeting the requirements of 48 V vehicle applications and platforms. The APL90 series currently offers a capacitance of 1,100 µF, a rated voltage of 63 VDC, as well as 20 g vibration resistance and ripple current capability up to 26 A. An important area of application for the APL90 series is the automotive sector, e. g. as a DC link in 48 V inverters for mild hybrid electric vehicles (MHEVs). These capacitors are suited for use in data centers, e. g. as input capacitors in power supply units for 48 V systems. Suitable for use at operating temperatures from -55 °C to +125 °C, the component is shaped for efficient arrangement in modules and can be positioned both horizontally and vertically. Its lifetime is specified with 2,000 hours at +125 °C (with V<sub>R</sub> and I<sub>R</sub> applied). | 25.07.2024 14:30:00 | Jul | news_2024-08-15_14.jpg | \images\news_2024-08-15_14.jpg | https://www.rutronik.com/article/for-48-v-applications-rutronik-introduces-the-new-aluminum-polymer-rectangular-capacitors-of-the-apl90-series-from-kemet | rutronik.com |
| Thermal Pads Protect EV Battery Packs | The Chomerics Division of Parker Hannifin has intr... | 12066 | Product Release | Thermal Pads Protect EV Battery Packs | The Chomerics Division of Parker Hannifin has introduced its THERM-A-GAP™ PAD 30 thermally conductive gap filler pads for EV battery packs that fits seamlessly into robotic assembly processes. THERM-A-GAP PAD 30 thermally conductive gap filler pads for EV battery pack applications are claimed to “provide exceptional performance and conformability”. During assembly, vision sensors can see THERM-A-GAP pads which enables effective quality control and fast production. The pads release directly from their liner for pick-and-place robots, making them well-suited for high-volume applications, and come in specially designed packaging to ensure safe shipment. The pads provide a soft (34 Shore 00) solution with 3.2 W/m-K of thermal conductivity and are claimed to offer low outgassing, ensuring an effective thermal interface between heat sinks and electronic devices where there are uneven surfaces, air gaps and rough surface textures. The supporting electrical properties of this RoHS-compliant thermal gap filler pad include: 5.9 kV<sub>AC</sub>/mm dielectric strength (ASTM D149 test method), 10<sup>13</sup> Ωcm volume resistivity (ASTM D257), 7.7 dielectric constant at 1,000 kHz (ASTM D150) and 0.001 dissipation factor at 1,000 kHz (Chomerics CHO-TM-TP13). | 25.07.2024 12:30:00 | Jul | news_2024-08-15_12.jpg | \images\news_2024-08-15_12.jpg | https://www.parker.com/us/en/divisions/chomerics-division/industries/automotive/error-proofing-tim-application-for-ev-battery-packs.html? | parker.com |
| High Current Three Phase EMC Filter | The chassis mounting three phase EMC filter series... | 12064 | Product Release | High Current Three Phase EMC Filter | The chassis mounting three phase EMC filter series MF423-3-3D-BB from EMIS is designed for higher current rating applications such as photovoltaic (PV) and power drive systems to meet relevant EMC Standards. Installed on the mains input side of equipment the filters improve conducted immunity and reliability. The devices are fitted with busbar termination. Other applications include inverters and converters, industrial three-phase systems and power supplies, large UPS, wind turbines, factory and building automation. Standard features include an operating voltage of 440/520 V<sub>AC</sub>, a current rating of 300 A to 1000 A at 40°C, 50/60 Hz operating frequency within the operating temperature range between -25 °C and +85°C. The climatic category is 25/85/21. | 25.07.2024 10:30:00 | Jul | news_2024-08-15_10.jpg | \images\news_2024-08-15_10.jpg | https://emisglobal.com/products/emi-filters/three-phase/three-stage/mf-423-3-3d-bb/ | emisglobal.com |
| High-Current eFuse with integrated Auto-Reset | Nexperia announced the NPS3102A and NPS3102B elect... | 12063 | Product Release | High-Current eFuse with integrated Auto-Reset | Nexperia announced the NPS3102A and NPS3102B electronic fuses (eFuses). These low-ohmic (17 mΩ), high current (13.5 A), resettable electronic fuses help to protect downstream loads from exposure to excessive voltages while also protecting power supplies from load faults and large inrush currents. They have been designed for use in various 12 V hot-swap applications including enterprise communication and storage equipment found in data centers such as drives, servers, ethernet switches and routers as well as to protect mobile communications infrastructure and industrial automation equipment like PLCs. The eFuses operate in the input voltage range up to 21 V. They are equipped with an integrated low-resistance pass MOSFET which minimizes voltage drop and power loss. The current clamp limit can be adjusted in the 2–13.5 A range using a resistor at the ILIM pin, which can also be used to measure load current in real time. Both devices include a built-in overvoltage clamp limiting the output voltage during an input overvoltage condition, with a 2 µs short-circuit protection response time. The pass-FET in the NPS3102A must be manually reset after a fault event whereas the NPS3102B integrates an auto-retry block, which safely attempts to re-enable the pass-FET without the need for user intervention. | 25.07.2024 09:30:00 | Jul | news_2024-08-15_9.jpg | \images\news_2024-08-15_9.jpg | https://www.nexperia.com/about/news-events/press-releases/nexperia-adds-new-high-current-efuse-with-superior-current-limiting-accuracy-to-its-power-device-portfolio | nexperia.com |
| 4.5 kW Power Supply for AI GPU Racks | Navitas Semiconductor released its 4.5 kW AI data ... | 12048 | Product Release | 4.5 kW Power Supply for AI GPU Racks | Navitas Semiconductor released its 4.5 kW AI data center power supply reference design, with GaNSafe™ and Gen-3 'Fast' (G3F) SiC power components. The design is claimed to "enable the world's highest power density with 137 W/in³ and over 97% efficiency". Next-generation AI GPUs like NVIDIA's Blackwell B100 and B200 each demand over 1 kW of power for high-power computation, 3x higher than traditional CPUs. These new demands are driving power-per-rack specifications from 30 - 40 kW up to 100 kW. The latest 4.5 kW CRPS185 design demonstrates how GaNSafe power ICs and GeneSiC™ Gen-3 'Fast' (G3F) MOSFETs enables highest power density and efficiency solution. At the heart of the design is an interleaved CCM totem-pole PFC using SiC with full-bridge LLC topology with GaN, where the fundamental strengths of each semiconductor technology are exploited for the highest frequency, coolest operation, optimized reliability and robustness, and highest power density and efficiency. The 650 V G3F SiC MOSFETs feature 'trench-assisted planar' technology which delivers "world-leading performance over temperature for the highest system efficiency and reliability in real-world applications". With a 3.2 kW power supply on the market Navitas plans to introduce an 8.5 kW design in September. | 25.07.2024 09:30:00 | Jul | news_2024-08-01_13.jpg | \images\news_2024-08-01_13.jpg | https://navitassemi.com/navitas-overcomes-ai-challenges-with-worlds-highest-power-density-data-center-design/ | navitassemi.com |
| Second Generation of 1200V SiC MOSFET for High Performance Applications | Power Master Semiconductor has released the 2nd ge... | 12061 | Product Release | Second Generation of 1200V SiC MOSFET for High Performance Applications | Power Master Semiconductor has released the 2nd generation of the 1200V <i>e</i> SiC MOSFET, which is intended for applications such as DC EV charging stations, solar inverters, energy storage systems, motor drives and industrial power supplies. The 1200 V devices are claimed to “offer e. g. higher power density, efficiency and less cooling effort due to its much lower power losses”. FOM characteristics such as gate charge (Q<sub>G</sub>), stored energy in output capacitance (EOSS), reverse recovery charger (Q<sub>RR</sub>) and output charge (Q<sub>OSS</sub>) are improved by up to 30 % compared to previous generation. All devices are 100 % tested in terms of avalanche capability. Due to its lower miller capacitance (Q<sub>GD</sub>) it achieved 44 % lower switching losses than the previous generation. | 25.07.2024 07:30:00 | Jul | news_2024-08-15_7.jpg | \images\news_2024-08-15_7.jpg | https://www.powermastersemi.com/product/product04.html | powermastersemi.com |
| Supply Chain for Power Devices based on AlN established | In order to make the ultra-wide band gap (UWBG) te... | 12043 | Industry News | Supply Chain for Power Devices based on AlN established | In order to make the ultra-wide band gap (UWBG) technology AlN accessible to industry in the medium term, the related existing activities in Germany have been combined in a strategic cluster. The aim is to establish a German value chain for AlN-based technology and to build up an international leadership position in this increasingly economically important field. The Ferdinand-Braun-Institut (FBH), the Fraunhofer Institute for Integrated Systems and Device Technology IISB and the company III/V-Reclaim PT GmbH drive this initiative together. They cover the entire value chain, starting with the growth of AlN crystals using the Physical Vapor Transport (PVT) process, to wafering and polishing of epi-ready AlN-wafers, and the epitaxy of the functional device layers, up to the fabrication of transistors for power electronics and millimeter-wave applications. For the first time, the consortium has now successfully demonstrated the practical implementation of a value chain for AlN devices in Germany and Europe. The first transistor generations produced with these wafers already show promising electrical properties, such as a breakdown voltage of up to 2200 V and a power density superior to SiC as well as GaN-based power-switching devices. Compared to established silicon devices, AlN/GaN HEMTs, as they have now been successfully produced on AlN wafers, offer up to three thousand times less conduction losses than with silicon and are around ten times more efficient than SiC transistors. | 24.07.2024 13:00:00 | Jul | news_2024-08-01_8.jpg | \images\news_2024-08-01_8.jpg | https://www.iisb.fraunhofer.de/en/press_media/press_releases/pressearchiv/archiv_2024/AlN-value-chain.html | iisb.fraunhofer.de |
| SEMICON Southeast Asia 2025 to be Held in Singapore | SEMICON Southeast Asia will return to its roots in... | 12058 | Event News | SEMICON Southeast Asia 2025 to be Held in Singapore | SEMICON Southeast Asia will return to its roots in Singapore in 2025 to commemorate its 30th anniversary. With more than 18,000 delegates expected to attend from the region and around the world, SEMICON Southeast Asia has become a key platform for industry leaders, innovators, and decision-makers to connect, collaborate, and drive innovation. This special edition of the event will take place at Sands Expo & Convention Centre from 20 – 22 May 2025. Themed "Stronger Together", SEMICON Southeast Asia 2025 will feature insights into the latest industry developments, trends and innovations, and critical areas including sustainability, artificial intelligence (AI), chiplet technology, and workforce development. Since 2015, SEMICON Southeast Asia has been hosted in Malaysia, contributing significantly to the growth and advancement of the semiconductor industry in the region. | 24.07.2024 09:00:00 | Jul | news_2024-08-15_4.jpg | \images\news_2024-08-15_4.jpg | https://www.semiconsea.org/ | semiconsea.org |
| Varistor Series Offers Surge Current Protection up to 6,000 A | KOA Speer Electronics introduces the NV73S series ... | 12052 | Product Release | Varistor Series Offers Surge Current Protection up to 6,000 A | KOA Speer Electronics introduces the NV73S series multilayer type metal oxide varistor that handles a surge current of up to 6,000 A, which is five times higher than existing products. The multilayer construction can absorb a large surge. The two-way symmetries can absorb positive and negative surges. The NV73S replaces the NV732E (1210) through 2L (2220) due to its improved surge protection. Maximum peak current and sizes for the new NV73S are 400 to 800 A (1210), 500 to 1,200 A (1812), and 1,500 to 6,000 A (2220) with a working voltage range of 6 to 95 V (AC) and 9 to 127 V (DC). The varistor voltage range for the NV73S series is 12 to 150 V. The NV73S series metal oxide varistor offers protection from ESD and EMI. It also provides surge protection for motors, relays, and solenoid valves. It meets EU-RoHS requirements. | 23.07.2024 13:30:00 | Jul | news_2024-08-01_17.jpg | \images\news_2024-08-01_17.jpg | https://www.koaspeer.com/news/1970/110/KOA_Speers_New_Varistor_Series_Offers_Surge_Current_Protection_Up_to_6000A_NV73S_Series/ | koaspeer.com |
| Supply Agreement: SiC MOSFETs for EVs | onsemi has signed a multi-year deal with Volkswage... | 12036 | Industry News | Supply Agreement: SiC MOSFETs for EVs | onsemi has signed a multi-year deal with Volkswagen Group to be the primary supplier of a complete power box solution as part of its next-generation traction inverter for its Scalable Systems Platform (SSP). The solution features silicon carbide-based technologies in an integrated module that can scale across all power levels – from high power to low power traction inverters to be compatible for all vehicle categories. Based on the EliteSiC M3e MOSFETs, onsemi's power box solution is said to be able to handle more power in a smaller package which significantly reduces energy losses. The inclusion of three integrated half-bridge modules mounted on a cooling channel will further improve system efficiency by ensuring heat is effectively managed from the semiconductor to the coolant encasement. This leads to better performance, improved heat control, and increased efficiency, allowing EVs to drive further on a single charge. | 22.07.2024 06:00:00 | Jul | news_2024-08-01_1.jpg | \images\news_2024-08-01_1.jpg | https://investor.onsemi.com/news-releases/news-release-details/onsemi-selected-power-volkswagen-groups-next-generation-electric | onsemi.com |
| SiC Modules for Power Grid Batteries | Infineon Technologies announced that its CoolSiC&t... | 12057 | Industry News | SiC Modules for Power Grid Batteries | Infineon Technologies announced that its CoolSiC™ 2000 V modules have been selected by Daihen Corporation for their unit-type power conditioners for grid storage batteries. The unit-type power conditioner for grid storage batteries launched by Daihen earlier this year is the first product in the industry to achieve connection to storage batteries at a high DC link voltage of 1500 V. The higher voltage enables the product to be used with large-capacity storage battery facilities, which has resulted in a 40 percent reduction in the footprint of grid storage batteries compared to the conventional product. The higher power density is achieved by using Infineon's 62 mm CoolSiC MOSFET 2000 V module FF3MR20KM1H. In addition to the characteristics of SiC that enable high voltage, better thermal dissipation and high power density, Infineon's SiC products feature M1H trench technology that increases the gate drive voltage range and provides high robustness and reliability against gate voltage spikes. | 19.07.2024 08:00:00 | Jul | news_2024-08-15_3.jpg | \images\news_2024-08-15_3.jpg | https://www.infineon.com/cms/en/about-infineon/press/market-news/2024/INFGIP202407-026.html | infineon.com |
| 150 V N-Channel Power U-MOS X-H MOSFETs | Toshiba Electronics Europe adds two 150 V N-channe... | 12065 | Product Release | 150 V N-Channel Power U-MOS X-H MOSFETs | Toshiba Electronics Europe adds two 150 V N-channel power MOSFET products based upon their U-MOS X-H Trench process. The TPH1100CQ5 and TPH1400CQ5 devices are designed specifically for use in high-performance switching power supplies, such as those used in data centers and communication base stations as well as other industrial applications. With a maximum drain-source voltage (V<sub>DSS</sub>) rating of 150 V and drain current (I<sub>D</sub>) handling of 49 A (TPH1100CQ5) and 32A (TPH1400CQ5), the devices feature a maximum drain-source on-resistance (R<sub>DS(ON)</sub>) of 11 mΩ and 14 mΩ, respectively. The reverse recovery charge (Qrr) of TPH1400CQ5 is 27 nC (typ.), and the typical reverse recovery time (trr) is 36 ns. Used in synchronous rectification applications, the TPH1400CQ5 reduces the power loss of switching power supplies and helps improve efficiency. When used in a circuit that operates in reverse recovery mode, the new products reduce spike voltages generated during switching, helping to improve EMI characteristics. The devices are housed in a surface-mount SOP Advance(N) package measuring 4.9 mm x 6.1 mm x 1.0 mm. A G0 SPICE model for rapid verification of the circuit function as well as highly accurate G2 SPICE models, for accurate reproduction of transient characteristics are also available. | 18.07.2024 11:30:00 | Jul | news_2024-08-15_11.jpg | \images\news_2024-08-15_11.jpg | https://toshiba.semicon-storage.com/eu/company/news/2024/07/mosfet-20240718-1.html | toshiba.semicon-storage.com |
| Memorandum of Understanding to stimulate sustainable Action across the Supply Chain | Infineon Technologies has signed a Memorandum of U... | 12038 | Industry News | Memorandum of Understanding to stimulate sustainable Action across the Supply Chain | Infineon Technologies has signed a Memorandum of Understanding with Amkor Technology, a provider of semiconductor packaging and test services, with a joint commitment to stimulate decarbonization and sustainability strategies across the supply chain. Expanding their partnership towards sustainability is the next step in the sustainability journey of both companies. Infineon and Amkor intend to fully leverage their classical Outsourced Semiconductor Assembly and Test (OSAT) business relationship in order to effectively tackle emissions along their supply chain. In April, both companies announced to operate a dedicated packaging and test center at Amkor's manufacturing site in Porto, Portugal. As part of the cooperation for climate protection, Infineon and Amkor will actively engage with common suppliers to help them develop and implement effective decarbonization strategies. This will involve workshops, meetings, and the sharing of best practices and learnings related to decarbonization. The aim is to identify areas for improvement and support suppliers in setting science-based emissions reduction targets in line with the Science Based Targets initiative. Both companies are committed to providing ongoing guidance, fostering exchange, and tracking progress to drive continuous improvement across the common supply chain. | 18.07.2024 08:00:00 | Jul | news_2024-08-01_3.jpg | \images\news_2024-08-01_3.jpg | https://www.infineon.com/cms/en/about-infineon/press/press-releases/2024/INFXX202407-025.html | infineon.com |
| PCIM Europe 2025: Call for Papers | Starting now, experts from the realms of business ... | 12044 | Event News | PCIM Europe 2025: Call for Papers | Starting now, experts from the realms of business and academia can submit their abstracts on a wide range of topics in power electronics for a chance to speak at the PCIM Conference 2025. This call for papers will be open until 15 October 2024. The PCIM Conference gives authors of first-time publications the opportunity to present their work to an international audience of more than 900 representatives from the business and scientific sides of power electronics. All those accepted will have their articles published in the PCIM Conference proceedings and databases like IEEE Xplore, IET Inspec Direct, Knovel, and Scopus. In addition, presenters at the PCIM Conference will benefit from the immediate feedback they receive from both the industry and the academic world – and they will be able to make a number of contacts in the power electronics community in the process. The PCIM Conference offers a several options to present: From 20-minute talks on the conference stages via poster presentations offering direct interaction directly with other attendees up to half-day seminars. This year's best submissions will be recognized in five categories by the Best Paper Award, the Young Engineer Award, and the Young Researcher Award. | 17.07.2024 14:00:00 | Jul | news_2024-08-01_9.jpg | \images\news_2024-08-01_9.jpg | https://pcim.mesago.com/nuernberg/en/press/press-releases/pcim-press-releases/callforpapers25.html | pcim.com |
| Testing Procedure for Determining Dielectric Strength | Würth Elektronik has developed a testing procedure... | 12040 | Industry News | Testing Procedure for Determining Dielectric Strength | Würth Elektronik has developed a testing procedure for determining the maximum operating voltage of molded inductors. The manufacturer of electronic and electromechanical components introduces developers to the electrical property of dielectric strength and what happens if it is exceeded in an application note. The molded inductors from the Power Magnetics product portfolio (e. g., WE-MAPI, WE-XHMI, WE-LHMI) are now successively supplemented with the value of the maximum operating voltage V<sub>op</sub> as a new parameter in the specifications. Based on the testing procedure, Würth Elektronik defines the maximum operating voltage V<sub>op</sub> in its data sheets. This represents the voltage at which an inductor can be operated continuously in the application without impairing performance, risking damage or overheating the inductor. The operating voltage is therefore a limit value for the input voltage, up to which the inductor can be used reliably in an application without irreversible damage. The test concept examines the behavior of inductors up to their voltage limits under realistic conditions in a DC/DC full-bridge converter (voltage transients of up to 60 V/ns and frequencies of up to 2 MHz). The approximate voltage limit is firstly evaluated using a short-term test. The operating voltage is then defined on this basis and verified in a long-term test. | 17.07.2024 10:00:00 | Jul | news_2024-08-01_5.jpg | \images\news_2024-08-01_5.jpg | https://www.we-online.com/en/news-center/press/press-releases?d=voltage-specification | we-online.com |
| Magnetic Packaging Technology for Power Modules: Cutting Size in half | Texas Instruments (TI) introduced six power module... | 12051 | Product Release | Magnetic Packaging Technology for Power Modules: Cutting Size in half | Texas Instruments (TI) introduced six power modules designed to improve power density, enhance efficiency and reduce EMI. These power modules leverage TI's proprietary MagPack™ integrated magnetic packaging technology, "shrinking their size by up to 23% compared to competing modules", enabling designers of industrial, enterprise and communications applications to achieve previously impossible performance levels. In fact, three of the six devices, the TPSM82866A, TPSM82866C and TPSM82816, are claimed to be "the industry's smallest 6 A power modules, supplying a power density of nearly 1A per 1 mm<sup>2</sup> of area". The magnetic packaging technology includes an integrated power inductor with proprietary, newly engineered material. As a result, engineers can now reduce temperature and radiated emissions while reducing both board space and system power losses. This is especially important in applications such as data centers, where electricity is the biggest cost factor, with some analysts predicting a 100% increase in demand for power by the end of the decade. | 16.07.2024 12:30:00 | Jul | news_2024-08-01_16.jpg | \images\news_2024-08-01_16.jpg | https://news.ti.com/2024-07-16-TI-pioneers-new-magnetic-packaging-technology-for-power-modules,-cutting-power-solution-size-in-half | ti.com |
| 3-Phase Brushless Gate Driver with Power Module and Sleep Mode | Microchip has launched the MPC8027, a 3-phase brus... | 12045 | Product Release | 3-Phase Brushless Gate Driver with Power Module and Sleep Mode | Microchip has launched the MPC8027, a 3-phase brushless gate driver module with a typical sleep-mode current of 5 µA. MCP8027 integrates three half-bridge drivers to drive external NMOS/NMOS transistor pairs configured to drive a 3-phase BLDC motor, a comparator, a voltage regulator to provide bias to a companion microcontroller, power monitoring comparators, an overtemperature sensor, two level translators and three operational amplifiers for motor current monitoring. The MCP8027 buck converter is capable of delivering 750 mW of power - may be disabled if not used - for powering a companion microcontroller. The onboard 5 V and 12 V LDO regulators are capable of delivering 30 mA of current. The MCP8027 operation is specified over a temperature range of -40°C to +150°C. Package options include the 40-lead 5x5 QFN and 48-lead 7x7 TQFP. For 100 ms the transient voltage tolerance is 48 V. Thermal warning and shutdown are also integrated. | 15.07.2024 06:30:00 | Jul | news_2024-08-01_10.jpg | \images\news_2024-08-01_10.jpg | https://www.microchip.com/en-us/product/MCP8027 | microchip.com |
| Hyperfast Recovery Rectifiers in D²PAK | Nexperia released 650 V ultra- and hyperfast recov... | 12053 | Product Release | Hyperfast Recovery Rectifiers in D²PAK | Nexperia released 650 V ultra- and hyperfast recovery rectifiers in D²PAK Real-2-Pin (R2P) packaging for use in various automotive, industrial and consumer applications including charging adapters, photovoltaic, inverters, servers and switched mode power supplies. Combining planar die technology with a state-of-the-art junction termination (JTE) design, these rectifiers offer high power density, fast switching times with soft recovery and excellent reliability. They are encapsulated in a D<sup>2</sup>PAK Real-2-Pin Package (SOT8018), which offers the same package outline as the standard D<sup>2</sup>PAK package but has only two pins instead of three (the middle cathode pin has been removed). This increases the pin-to-pin distance from 1.25 mm to over 4 mm, which allows to meet the creepage and clearance requirements stated in the IEC 60664 standard. | 10.07.2024 14:30:00 | Jul | news_2024-08-01_18.jpg | \images\news_2024-08-01_18.jpg | https://www.nexperia.com/about/news-events/press-releases/Nexperia-s-650-V-ultra--and-hyperfast-recovery-rectifiers-in-D2PAK-Real-2-Pin-packaging-offer-high-efficiency-and-reliability | nexperia.com |
| Opening of Wafer Testing Site in Malaysia | Melexis has opened its largest wafer testing site ... | 12042 | Industry News | Opening of Wafer Testing Site in Malaysia | Melexis has opened its largest wafer testing site worldwide in Kuching, Sarawak, Malaysia. This expansion also increases Melexis' presence in the Asia-Pacific region. The expansion in Malaysia is said to allow the company to fulfil the growing global demand for semiconductors, which is expected to double in the next decade. It hosts 90 semiconductor wafer test equipments used to test ICs. Melexis will use the site for edge sensors and edge drivers aimed at current and future applications in the mobility, sustainability, robotics, and health areas. Placing the facility in Kuching - Sarawak - Malaysia, member of the Association of Southeast Asian Nations (ASEAN), between Eastern and Western markets and next to X-FAB's wafer foundry, one of Melexis' key suppliers, is a strategic move to streamline logistics and help reducing the company's ecological footprint. The 4-storey building, designed by, both award-winning, Belgian architect Sebastian Mortelmans and Sarawakian architects DNA, covers a ground surface of 4,500 square metres, making it the largest Melexis wafer testing site worldwide. The modern design referencing local longhouse architecture, incorporates energy-saving systems including a solar installation that can generate 30.000 kWh per month. The facility is designed with future expansions in mind. | 10.07.2024 12:00:00 | Jul | news_2024-08-01_7.jpg | \images\news_2024-08-01_7.jpg | https://www.melexis.com/en/news/2024/10jul2024-melexis-opens-its-largest-wafer-testing-site-worldwide-in-malaysia | melexis.com |
| Analog-Digital Fusion Control Power Supply Solution | Rohm has established LogiCoA™, a power suppl... | 12050 | Product Release | Analog-Digital Fusion Control Power Supply Solution | Rohm has established LogiCoA™, a power supply solution for small to medium power industrial and consumer equipment (30 W to 1 kW class). It provides the same functionality as fully digital control power supplies at low power consumption and cost equivalent to analog power types. The LogiCoA power solution leverages the strengths of both analog and digital technologies. Low power LogiCoA MCUs are utilized to facilitate control of a variety of power supply topologies. The LogiCoA brand embodies a design philosophy of fusing digital elements to maximize the performance of analog circuits. Rohm claims that its LogiCoA power solution is "the industry's first analog-digital fusion control power supply that combines a digital control block" centered around the LogiCoA MCU with analog circuitry comprised of silicon MOSFETs and other power devices. The evaluation reference design REF66009 allows users to experience the LogiCoA power supply solution in a non-isolated buck converter circuit. Various tools necessary for evaluation are also offered, including circuit diagrams, PCB layouts, parts lists, sample software, and support documents, while actual device evaluation is possible using the optional EVK-001 evaluation board. | 10.07.2024 11:30:00 | Jul | news_2024-08-01_15.jpg | \images\news_2024-08-01_15.jpg | https://www.rohm.com/news-detail?news-title=2024-07-10_news_logicoa&defaultGroupId=false | rohm.com |
| Several Changes in Management | After more than 25 years at Schurter, the current ... | 12037 | People | Several Changes in Management | After more than 25 years at Schurter, the current Managing Director (MD), Rolf Hausheer, will retire at the end of 2024. He handed over the position of MD of Schurter AG to Steffen Lindner on 1 July 2024. Steffen Lindner is already acting as the General Manager & Vice President EMEA. Rolf Hausheer's career at Schurter began in April 1999 as the Head of Procurement. As of 2009, he was appointed to the management team, taking responsibility for Supply Chain Management, including Sourcing, Customer Service, and Warehouse. Since February 2024, Rolf Hausheer has been leading Schurter AG as MD ad interim. Despite the additional responsibility as MD, he retained leadership of Supply Chain Management and supported the strategic direction of the company as Co-Program Management Officer. Furthermore, as of July 2024, Steffen Lindner has assumed the role of MD of Schurter AG. He already manages the Schurter group company in Germany and oversees all company activities in EMEA, including Product Management, Engineering, Sales, and Production. Simultaneously, responsibility for Supply Chain Management has been handed over to Oswald Fiegl, the acting COO. Rolf Hausheer is now focusing on organizational projects within the company's strategy. | 10.07.2024 07:00:00 | Jul | news_2024-08-01_2.jpg | \images\news_2024-08-01_2.jpg | https://www.schurter.com/en/news/handover-at-schurter-ag | schurter.com |
| Faster Development Processes for DC Charging Stations | The charging controller developer Vector Informati... | 12024 | Industry News | Faster Development Processes for DC Charging Stations | The charging controller developer Vector Informatik and AST International are now offering a joint solution for the development of DC charging stations. The compatibility of the communication protocols of the Vector charging controller vSECC and the AST DC meter is ensured, which enables charging station manufacturers to offer a convenient plug-and-play solution. This shortens development times and enables complete integration. Vector's vSECC controllers control the charging communication between electric vehicles, charging station components and backend systems and support common charging standards such as CCS, NACS, CHAdeMO and MCS. The AST DC Meters provide continuous precise measurements for fast charging stations, megawatt charging systems and DC wallboxes. They are certified according to German, European and North American calibration law requirements. | 09.07.2024 14:00:00 | Jul | news_2024-07-15_9.jpg | \images\news_2024-07-15_9.jpg | https://www.ast-international.com/en.news.faster-development-processes-for-dc-charging-stations-thanks-to-partnership-between-vector-informatik-and-ast-international.html | ast-international.com |
| Scalable Industry 4.0-ready Zero-Downtime Industrial Power Supply Series | The CPS-i series from CAMTEC Power Supplies is bas... | 12067 | Product Release | Scalable Industry 4.0-ready Zero-Downtime Industrial Power Supply Series | The CPS-i series from CAMTEC Power Supplies is based on a specific steering and control architecture. It is designed for testing automation and high-end industrial lab power supply users. It supports production process planners as well as energy and water infrastructure or UPS-system engineers. It offers free scalability from 2000 W up to 105 kW power output, accompanied by flexible up- and downscaling and service by the customer himself. The CPS-I series connects up to 35 power supply units to form a large (DC grid) network by configuring master-slave-master to slave systems. With its modular design it is possible to scale this system to the required power. If the power supply units are decoupled from each other, the result will be independent systems, which can then be used stand-alone or in new arrangements, provided one inexpensive power supply unit is added to each new block. Configuration and maintenance are achieved via web browser. Defect LAN interfaces can be replaced by the system operator himself, as the interfaces recognize the power supply unit on their own and calibrate themselves. Defect devices, therefore, don't have to go back to the service unit, but can be repaired on-site. | 09.07.2024 13:30:00 | Jul | news_2024-08-15_13.jpg | \images\news_2024-08-15_13.jpg | https://www.camtec-powersupplies.com/ | camtec-powersupplies.com |
| Battery Protector Series to Prevent Li-ion Battery Pack Damage | Littelfuse announced the extension of its ITV2718 ... | 12049 | Product Release | Battery Protector Series to Prevent Li-ion Battery Pack Damage | Littelfuse announced the extension of its ITV2718 surface-mountable Li-ion battery protector series. These fuses safeguard Li-ion battery packs against overcurrent and overcharging (overvoltage) conditions - even when fast charging. The latest addition, the ITV2718, provides a five-amp, three-terminal fuse in a 2.7 mm x 1.8 mm footprint. The design utilizes an embedded fuse and heater element combination to respond quickly, interrupting the battery pack's charging or discharging circuit before overcharging or overheating conditions occur. The ITV2718 Battery Protector is suited for a wide range of consumer electronics applications, including game consoles, E-call, portable routers and modems, smartphones, notebooks and tablets. It meets industry safety requirements via UL and TÜV certifications for faster compliance approval while being halogen-free and RoHS compliant environmentally friendly components. | 09.07.2024 10:30:00 | Jul | news_2024-08-01_14.jpg | \images\news_2024-08-01_14.jpg | https://www.littelfuse.com/about-us/news/news-releases/2024/littelfuse-adds-itv2718-5-amp-rated-battery-protector-series-to-prevent-li-ion-battery-pack-damage.aspx | littelfuse.com |
| Optocoupler Series expanded with Opto-TRIACs | Würth Elektronik now offers a solution for phase c... | 12054 | Product Release | Optocoupler Series expanded with Opto-TRIACs | Würth Elektronik now offers a solution for phase control of AC loads, the WL-OCTR optocouplers, a safe alternative to mechanical relays. The TRIAC optocouplers are particularly suitable for use in lamp dimming functions and AC motor drivers in household appliances. They can also be used as drivers for high-current TRIACs. These optocouplers are available with and without a zero-cross function to shift the TRIAC switch-on point. The portfolio includes both THT and SMT designs in DIP4, DIP6 and SOP4 packages and offers trigger currents of 5, 10 or 15 mA. A CTI (Comparative Tracking Index) value (describing leakage current stability) of over 500 and insulation voltages of 3750 or 5000 V for the THT and SMT designs makes the optocouplers well-suited for circuit protection. Like all optocouplers from Würth Elektronik, the newest addition to the optocoupler portfolio is certified to all necessary standards: UL1577, EN IEC 60747-5-5 VDE 0884-5, CQC GB 4941.1-2022. | 04.07.2024 15:30:00 | Jul | news_2024-08-01_19.jpg | \images\news_2024-08-01_19.jpg | https://www.we-online.com/en/news-center/press/press-releases?d=optocoupler-series-with-Opto-TRIACs | we-online.com |
| New Building for more SiC Wafer Production Space | In an important step towards strengthening the sem... | 12018 | Industry News | New Building for more SiC Wafer Production Space | In an important step towards strengthening the semiconductor industry and promoting sustainable technologies, SiCrystal will create additional production space in the north-east of Nuremberg, directly opposite the existing site. The new building will offer an additional 6,000 square meters of production space and will be equipped with state-of-the-art technology to further optimize the production of silicon carbide wafers. The close proximity to the existing plant will ensure close integration of the production processes. SiCrystal's total production capacity, including the existing building, will be approximately three times higher in 2027 than in 2024. "This groundbreaking ceremony marks an important milestone for SiCrystal and underlines our commitment to the metropolitan region. In this way, we can continue to supply innovative products of the highest quality for our customers in the future and make a positive contribution to global sustainability. ", said Dr. Erwin Schmitt, COO of SiCrystal. "With the additional production capacities, we will strengthen our market position and make an important contribution to technological development in the semiconductor industry." | 04.07.2024 08:00:00 | Jul | news_2024-07-15_3.jpg | \images\news_2024-07-15_3.jpg | https://www.sicrystal.de/index.php/de/news | sicrystal.de |
| Experts for WBG-Testing Acquired | After receiving approval from the British and Ital... | 12020 | Industry News | Experts for WBG-Testing Acquired | After receiving approval from the British and Italian governments, Microtest Group announces the acquisition of ipTEST. ipTEST specializes in testing silicon carbide and gallium nitride semiconductors, with locations in Guildford (UK) and Ipoh (Malaysia) and reported €22 million in revenue in 2023. This transaction marks the fourth acquisition for the Group in just over a year - following the 2023 acquisitions of the Dutch company Test Inspire, the German company RoodMicrotec and the Italian company GEDEC. This move is part of the growth and international development strategy launched in 2022 with the support of Xenon Private Equity, aiming to make Microtest the European reference point for chip design (ASIC), test systems and in the testing of microchips on package and silicon wafers. From an industrial perspective, integrating ipTEST will bring significant expertise in innovative device development, such as the new DS5, which won the prestigious King's Award for Enterprise in 2023 and 2024 for silicon carbide and gallium nitride semiconductor testing. These frontier semiconductors are crucial for managing electric vehicle batteries and inverters, with expected growth of over 30% annually in the next five years due to the ongoing energy transition. This acquisition will enable Microtest to serve power microchip manufacturers making substantial investments to meet new sector demands, including the main IDM’s in the industry ST Microelectronics, Infineon and Wolfspeed. | 03.07.2024 10:00:00 | Jul | news_2024-07-15_5.jpg | \images\news_2024-07-15_5.jpg | https://www.microtest.net/microtest-group-acquires-iptest/ | microtest.net |
| Technology Acquisition Expands Power Management Solutions | GlobalFoundries announced that it has acquired Tag... | 12017 | Industry News | Technology Acquisition Expands Power Management Solutions | GlobalFoundries announced that it has acquired Tagore Technology’s proprietary and production proven Power Gallium Nitride (GaN) IP portfolio, a high-power density solution designed to push the boundaries of efficiency and performance in a wide range of power applications in automotive, internet of things (IoT) and artificial intelligence (AI) datacenter. As the digital world continues to evolve with technologies like Generative AI, GaN stands out as a pivotal solution for sustainable and efficient power management particularly in datacenters. The announcement reinforces GF’s commitment to large-scale manufacturing of GaN technology that offers a suite of benefits to help datacenters meet the increasing power demands while maintaining or improving power efficiency, reducing costs and managing heat generation. The acquisition expands GF’s power IP portfolio and broadens access to GaN IP that will enable GF customers to quickly bring differentiated products to market. As a part of the acquisition, a team of experienced engineers from Tagore, dedicated to the development of GaN technology, will be joining GF. “We are committed to being the foundation of our customers’ power applications today and for decades to come,” said Niels Anderskouv, chief business officer at GF. “With this acquisition, GF takes another step toward accelerating the availability of GaN and empowering our customers to build the next generation of power management solutions that will reshape the future of mobility, connectivity and intelligence.” | 01.07.2024 07:00:00 | Jul | news_2024-07-15_2.jpg | \images\news_2024-07-15_2.jpg | https://gf.com/gf-press-release/globalfoundries-acquires-tagore-technologys-gan-technology-to-accelerate-disruptive-powermanagement-solutions/ | gf.com |
| Open for Proposals for Power Event | APEC now accepts Professional Education Seminar Pr... | 12041 | Event News | Open for Proposals for Power Event | APEC now accepts Professional Education Seminar Proposals for APEC 2025, which will take place March 16-20, 2025 at the Georgia World Congress Center in Atlanta, GA (USA). APEC continues the tradition of focusing on the practical aspects of the power electronics profession; the Professional Education Seminars at APEC 2025 will address the need for in-depth discussions of important and complex power electronics topics. Each seminar combines practical application with theory designed to further educate the working professional in power electronics or related fields. Topics are to address the practical issues of the specification, design, manufacture and marketing of power electronic components, products, and systems. Proposals focusing on, but not limited to, any of the following areas of power electronics are welcome. All the relevant details can be found the APEC website, including submission requirements and additional details. | 28.06.2024 11:00:00 | Jun | news_2024-08-01_6.jpg | \images\news_2024-08-01_6.jpg | https://apec-conf.org/speakers/seminar-speaker-info/ | apec-conf.org |
| Attracting more People to Careers in the Semiconductor Industry | The CHIPS of Europe (Creating Higher-Education Ind... | 12039 | Industry News | Attracting more People to Careers in the Semiconductor Industry | The CHIPS of Europe (Creating Higher-Education Industry Programmes for the Semiconductor Industry of Europe) project is addressing the shortage of workforce in the EU semiconductor industry. In the next four years industry and academia will work together to increase the attractiveness of semiconductor-related study programs and careers. The need for more skilled workers in the EU semiconductor industry has increased due to the new investments via the EU Chips Act. If no action is taken, the EU semiconductor industry will face a shortage of 350,000 workers by 2030. CHIPS of Europe intends to increase the attractiveness of semiconductor-related study programmes and careers. It brings together large companies and small and medium-sized enterprises, such as Infineon, Imec, X-Fab, Cadence, Nextnano, and universities. The project includes partners from fascinating application fields such as medical and space which touch on the hearts and minds of future workforce. Involving 14 full and 7 associated partners from 10 countries spread across Europe, the project employs targeted measures in order to leave a sustainable impact on the European semiconductor ecosystem. The CHIPS of Europe project is co-funded by the European Union (Digital Europe – Reinforcing skills in semiconductors) semiconductor ecosystem. There will also be summer schools at fabs and virtual labs. | 28.06.2024 09:00:00 | Jun | news_2024-08-01_4.jpg | \images\news_2024-08-01_4.jpg | https://www.ecpe.org/research/chips-of-europe/chips-of-europe/ | ecpe.org |
| Charity Benefit from PCIM Booth for Education in Ecuador | Vincotech staged a charity benefit at the PCIM Eur... | 11986 | Industry News | Charity Benefit from PCIM Booth for Education in Ecuador | Vincotech staged a charity benefit at the PCIM Europe trade fair to raise funds for the NGO Plan International Germany. Visitors rose to this virtual reality (VR) challenge. Vincotech and its partners rewarded their efforts by donating €15,000 to a project to support young Ecuadorians. Vincotech has a history of hosting charity events at PCIM Europe. Ranging from wall climbing to Sudoku, these activities have been a big hit with fairgoers. This year’s event – a VR flight over mountainous terrain – was yet another audience magnet. Hundreds of PCIM Europe visitors (including a Bodo’s Power System editor) took up the challenge, with Vincotech matching all pledges to raise €15,000 for a Plan International Germany project in Ecuador. The money goes to support youngsters, especially girls, in ten communities each in the Cotopaxi and Santa Elena regions. It funds projects to convey entrepreneurial, digital, and soft skills that will help them get off to a better start in professional life, as well as health services for mothers and children. This project, which involves 2,000 individuals directly and indirectly benefits nearly 6,000 community members, is a certainly a winning proposition young Ecuadorians in the region. Plan International is an independent organization, with no religious, political or governmental affiliations, standing up for children’s rights worldwide and striving to be open, accountable and honest in what the NGO does. | 27.06.2024 16:00:00 | Jun | news_2024-07-01_10.jpg | \images\news_2024-07-01_10.jpg | https://www.vincotech.com/news/company-news/article/vincotechs-pcim-booth-raises-eur15000-for-project.html | vincotech.com |
| Connecting Engineers to the Future of EV/HEV Technology | Mouser Electronics explores the latest development... | 12023 | Industry News | Connecting Engineers to the Future of EV/HEV Technology | Mouser Electronics explores the latest developments, advancements and challenges in electric and hybrid vehicle technology through its EV/HEV resource hub. Staying ahead in this rapidly evolving industry is crucial for engineers and innovators. With advancing technologies like bi-directional charging and vehicle autonomy entering the market, it's more important than ever to stay up to speed. Mouser's EV/HEV resource hub offers a wealth of engaging content, including eBooks, blogs, articles, products, and more, all designed to keep engineers at the forefront of these technological advancements. Electric infrastructure is advancing with the use of emerging technologies, such as liquid-cooled HPC connectors, while still maintaining the latest industry standards and lowering maintenance costs. This development empowers the future of eMobility, as discussed in Mouser's interactive content series <i>“Electrifying the Future of eMobility”</i>, exploring how current renewable energy sources and evolving technologies like hydrogen electrolysis are driving toward a net-zero future. The EV/HEV technology content hub offers engineers access to resources from Mouser's technical team and leading manufacturers. In a recent eBook with TE Connectivity, <i>“EV and Connected Transportation”</i>, industry experts explain the tandem movement of e-mobility and connected travel via new standards and the use of the V2X ecosystem to make more efficient, accurate, and safer roads for vehicles. | 27.06.2024 13:00:00 | Jun | news_2024-07-15_8.jpg | \images\news_2024-07-15_8.jpg | https://eu.mouser.com/newsroom/publicrelations-application-resource-ev-hev-2024final/ | mouser.com |
| Power Factor Correction: Chokes with High-Current Offerings | ITG Electronics has expanded its portfolio of powe... | 12046 | Product Release | Power Factor Correction: Chokes with High-Current Offerings | ITG Electronics has expanded its portfolio of power factor correction chokes (PFCs) with a set of solutions designed for comparatively high-wattage applications. The company's PFC383637B Series solutions can handle up to 3,300 W and include CCM PFC boost converters with switching frequencies from 60 to 200 kHz. An extension of ITG Electronics' Cubic Design set of power factor correction chokes, PFC383637B Series solutions are suitable for Inductance ranges from 180 – 360 µH at footprints up to 37.5 mm x 36.5 mm with maximum heights of 36 mm. Compared with traditional toroidal-shaped PFC chokes, the PFC383637B Series features a flat wire and square core construction to save space and increase power density. The solutions are up to 50% smaller compared to toroidal-shaped PFC chokes with similar power ratings, and their flat wire technology can reduce DC resistance by as much as 40%, leading to substantially lower copper losses. The PFC383637B Series of PFC chokes is applicable for AC to DC conversion in industrial, equipment and automotive applications. Notably, the high-current output chokes can handle up to 32.4 A with approximately 50% roll off. | 27.06.2024 07:30:00 | Jun | news_2024-08-01_11.jpg | \images\news_2024-08-01_11.jpg | https://www.itg-electronics.com/en/category/4 | itg-electronics.com |
| electronica 2024: Answers to the major Challenges facing the Automotive Industry | From connected mobility to autonomous driving or s... | 12019 | Event News | electronica 2024: Answers to the major Challenges facing the Automotive Industry | From connected mobility to autonomous driving or sustainability – the automotive industry is facing major challenges on its path to digitalization and electrification. The most important companies in the electronics industry will network with the automotive industry and shape the future at the international platform electronica 2024 from November 12 to 15, 2024 in Munich. Despite the discontinuation of subsidies and the lack of infrastructure in some areas, the future belongs to electric drives, and electrification is progressing around the world in all vehicle classes. The software, battery and electronics industries play key roles here. When it comes to batteries, future technologies such as solid-state batteries with a higher energy density will set new standards in terms of charging time, range, fire safety and cost efficiency. In addition, electronica 2024 will focus primarily on the electronic components, technologies and solutions required for the mobility transition. Silicon carbide (SiC) and gallium nitride (GaN) semiconductors with a wide bandgap, for example, are being used more and more in electric drives due to their high efficiency level and energy efficiency, and they are becoming even more powerful. There is a further increase in the switching frequency in inverters, which boosts driving comfort and energy efficiency. | 26.06.2024 09:00:00 | Jun | news_2024-07-15_4.jpg | \images\news_2024-07-15_4.jpg | https://electronica.de/en/trade-fair/journalists/press-releases/detail/answers-to-the-major-challenges-facing-the-automotive-industry.html | electronica.de |
| Call for Industry Session Proposals and for Plenary Session Topics and Speakers | APEC 2025, to be held next year in Atlanta, Georgi... | 12016 | Event News | Call for Industry Session Proposals and for Plenary Session Topics and Speakers | APEC 2025, to be held next year in Atlanta, Georgia, March 16-20, announces the call for submission of proposals for the conference’s popular Industry Session series. The Industry Session component of the conference is intended to encourage content from industry practitioners. Industry Session (IS) speakers are invited to make a presentation only, avoiding the formality of writing the papers for IEEE Xplore publication. IS tracks run in parallel with APEC Technical Sessions and the presentations are included for download by paid APEC attendees. The deadline for submission of proposals is August 23rd. Industry Session proposals may be submitted for an individual speaker presentation or for an overall session proposal. The total time allowed for each presentation is 25 minutes, including 5 minutes for Q and A. To submit a proposal for an Industry Session at APEC, presenters should prepare a 2-3-page proposal that provides a summary of the presentation content and a description of the target audience. Also, a short professional biography of the speaker should be included. If proposing for a full session, a proposal for each of the individual presentations must be submitted. Presentations should have strong technical content and commercial references should be limited and only in support of the core content. | 26.06.2024 06:00:00 | Jun | news_2024-06-01_2.jpg | \images\news_2024-06-01_2.jpg | https://apec-conf.org/speakers/is-presenter-info/ | apec-conf.org |
| Collaboration between Semiconductor Manufacturer and Power Supply Provider | Texas Instruments (TI) announced a long-term colla... | 11980 | Industry News | Collaboration between Semiconductor Manufacturer and Power Supply Provider | Texas Instruments (TI) announced a long-term collaboration with Delta Electronics, a global power and energy management manufacturer, to create next-generation electric vehicle (EV) onboard charging and power solutions. This work will leverage both companies’ research and development capabilities in power management and power delivery in a joint innovation laboratory in Pingzhen, Taiwan. Together, TI and Delta aim to optimize power density, performance and size to accelerate the realization of safer, faster-charging and more affordable EVs. Phase one for the collaboration focuses on Delta’s development of a lighter-weight, cost-effective 11 kW onboard charger, using TI’s latest C2000™ real-time microcontrollers and TI’s active EMI filter products. The companies are working together using TI’s products to reduce the charger’s size by 30% while achieving up to 95% power conversion efficiency. In phase two, TI and Delta will leverage the latest C2000 real-time MCUs for automotive applications to enable automakers to achieve automotive safety integrity levels (ASILs) up to ASIL D, which represents the strictest automotive safety requirements. Highly integrated automotive isolated gate drivers will further enhance the power density of onboard chargers, while also minimizing overall solution size. In phase three, the two companies will collaborate to develop the next generation of automotive power solutions by using GaN technology. | 21.06.2024 10:00:00 | Jun | news_2024-07-01_4.jpg | \images\news_2024-07-01_4.jpg | https://news.ti.com/2024-06-21-Texas-Instruments-and-Delta-Electronics-announce-collaboration-to-advance-electric-vehicle-onboard-charging | ti.com |
| Acquisition of GaN Manufacturer completed | Renesas Electronics has completed the acquisition ... | 11982 | Industry News | Acquisition of GaN Manufacturer completed | Renesas Electronics has completed the acquisition of Transphorm, a company which concentrates its activities on GaN power semiconductors, as of June 20, 2024. With the closing of the acquisition now completed, Renesas will immediately start offering GaN-based power products and related reference designs to meet the rising demand for wide bandgap semiconductor products. Investing in the power business is an important part of Renesas’ strategy for achieving sustainable, long-term growth. Other recent moves that Renesas has made to bolster this market segment include: the opening of the Kofu Factory, a dedicated 300-mm wafer fab for power products; ramping up a new SiC production line at the Takasaki Factory; and forging an agreement with Wolfspeed to secure a steady supply of SiC wafers over the next 10 years. With GaN technology now part of Renesas’ portfolio, Renesas is poised to offer more comprehensive power solutions to support the evolving needs of customers across a broad range of applications. On the same day that it completed the acquisition of Transphorm, Renesas rolled out 15 market-ready reference designs that combine the new GaN products with Renesas’ embedded processing, power, connectivity and analog portfolios. These include the designs of Transphorm’s automotive-grade GaN technology integrated for on-board battery chargers as well as 3-in-1 powertrain solutions for EVs. Transphorm was founded in 2007 in Goleta, California. | 20.06.2024 12:00:00 | Jun | news_2024-07-01_6.jpg | \images\news_2024-07-01_6.jpg | https://www.renesas.com/us/en/about/press-room/renesas-completes-acquisition-transphorm | renesas.com |
| 700 V GaN Power Transistors | Infineon introduces the CoolGaN™ Transistor ... | 12030 | Product Release | 700 V GaN Power Transistors | Infineon introduces the CoolGaN™ Transistor 700 V G4 product family. The devices are intended for power conversion in the voltage range up to 700 V. In contrast to other GaN products on the market, the input and output figures-of-merit of these transistors are claimed to “provide a 20 percent better performance, resulting in increased efficiency, reduced power losses, and more cost-effective solutions”. The combination of electrical characteristics and packaging allows the usage in applications such as consumer chargers and notebook adapters, data center power supplies, renewable energy inverters, and battery storage. The product series comprises 13 devices with a voltage rating of 700 V and on-resistance range from 20 mΩ to 315 mΩ. The increased granularity in device specification, combined with several industry standard package options including PDFN, TOLL and TOLT allow R <sub>DS</sub> resistance and packages to be selected according to application requirements. The devices are “characterized by a fast turn-on and turn-off speed and minimal switching losses”. The on-resistance range enables power systems from 20 W to 25,000 W. In addition, the 700 V E-mode with the industry's highest transient voltage of 850 V increases the reliability of the overall system as it offers greater robustness against anomalies in the user environment such as voltage peaks. | 20.06.2024 11:30:00 | Jun | news_2024-07-15_15.jpg | \images\news_2024-07-15_15.jpg | https://www.infineon.com/cms/en/about-infineon/press/market-news/2024/INFPSS202406-120.html | infineon.com |
| Distributor receives ISO 27001 Certification | DigiKey has added ISO 27001 certification to its d... | 11981 | Industry News | Distributor receives ISO 27001 Certification | DigiKey has added ISO 27001 certification to its data security program. With this certification, the company builds upon its commitment and ability to manage information securely and safely for its customers, suppliers and partners. ISO 27001 is the international industry standard for information security management systems. It assures customers, suppliers and employees of DigiKey's commitment to safeguarding information following industry best practices. In addition to ISO 27001 certification, DigiKey’s information security program offers customers and suppliers access to other robust tools such as multi-factor authentication (MFA) to protect accounts from fraud and unauthorized access. | 20.06.2024 11:00:00 | Jun | news_2024-07-01_5.jpg | \images\news_2024-07-01_5.jpg | https://www.digikey.com/en/news/press-releases/2024/june/digikey-receives-iso-27001-certification-adding-to-robust-information-security-program | digikey.com |
| Redundant analog TMR angle Sensor for safety-relevant Applications | TDK launched the tunnel-magnetoresistance (TMR) an... | 11991 | Product Release | Redundant analog TMR angle Sensor for safety-relevant Applications | TDK launched the tunnel-magnetoresistance (TMR) angle sensor TAS8240 sensor for automotive and industrial applications. It is available in both compact QFN16 (3 x 3 mm<sup>2</sup>) and TSSOP16 (5 x 6.4 mm<sup>2</sup>) packages, offering four redundant analog single-ended SIN/COS outputs. TAS8240 is a redundant TMR-based sensor consisting of 4 x Wheatstone bridges for angle detection at an angle accuracy of ±1.0° in an ambient temperature range of -40 °C to +150 °C. As a 360° angle sensor, the TAS8240 is suited to accurately measure the rotor position of BLDC motors used in safety critical applications such as power steering, brake boosters, or traction motors. The sensor contains four pairs of TMR half bridges and provides four separated SIN/COS outputs by applied magnetic field in the x-y plane. Higher system safety levels up to ASIL D can be achieved while offering higher availability of position information, even in case of a failure of one of the output signals. Depending on system architectures, fail-operational concepts can also be supported by the new sensor. The angle accuracy of the sensor remains stable at different temperatures and over the sensor’s lifetime. It provides redundant rotor position measurement needed in safety-relevant applications like power steering motors. | 20.06.2024 10:30:00 | Jun | news_2024-07-01_15.jpg | \images\news_2024-07-01_15.jpg | https://www.tdk.com/en/news_center/press/20240620_01.html | tdk.com |
| APEC 2025 Announces Call for Technical Program Paper Digest Submissions | APEC 2025, to be held in Atlanta, Georgia, from Ma... | 11976 | Event News | APEC 2025 Announces Call for Technical Program Paper Digest Submissions | APEC 2025, to be held in Atlanta, Georgia, from March 16-20, 2025, continues the long-standing tradition of addressing issues of immediate and long-term interest to the practicing power electronics engineer. APEC is now accepting paper digest submissions for the Technical Program. Interested authors wishing to present a paper must submit a digest for consideration by August 2, 2024. Instructions for submissions are available at: https://apec-conf.org/speakers/ts-author-info/<br>Prospective authors of Technical Program papers are asked to submit a digest explaining the problem that will be addressed by the paper, its major results and how it is different from the closest existing literature. Technical Program Papers presented at APEC must be original material and not have been previously presented or published. The principal criteria used by reviewers in selecting digests for the program will be the usefulness of the work to the practicing power electronics professional. They also value evidence of completed experimental work. Authors should obtain any necessary company and governmental clearance prior to submission of digests. Authors will be notified of the decision of paper acceptance on September 26, 2023. Accepted papers in final form must be submitted and author registration completed by November 3, 2023. | 20.06.2024 06:00:00 | Jun | news_2024-06-01_2.jpg | \images\news_2024-06-01_2.jpg | https://apec-conf.org/speakers/ts-author-info/ | apec-conf.org |
| Modern Semiconductor Technology for the Automotive Industry | Vishay Siliconix Itzehoe celebrated the topping-ou... | 12035 | Industry News | Modern Semiconductor Technology for the Automotive Industry | Vishay Siliconix Itzehoe celebrated the topping-out ceremony for its new 300mm wafer fab, a significant milestone in the comprehensive expansion of the site. Representatives from business, politics and the workforce took part in this important event, which marks progress towards the completion and commissioning of the new production facility. Leif Henningsen, Managing Director of Vishay Siliconix Itzehoe GmbH, and Jeff Webster, Chief Operating Officer of Vishay Intertechnology, thanked all those involved in the construction and employees on behalf of the entire Vishay management for completing the shell of the building on schedule. Julia Carstens, State Secretary in the Schleswig-Holstein Ministry of Economic Affairs, and District Administrator Claudius Teske emphasized the great economic importance of the new factory for the region. It will create 150 new jobs and significantly strengthen the local economy. The heart of the new production facility is a 4,000 m<sup>2</sup> clean room, which is constantly operated at 22 degrees Celsius and 43% humidity. The fully digital factory is designed for the use of artificial intelligence and state-of-the-art automation technology. This ensures the consistently high quality for which Vishay is renowned. "We are building one of the most modern and efficient factories in the world in our technology segment," emphasizes Jeff Webster. The expansion is part of Vishay Intertechnology's global growth program. | 19.06.2024 16:30:00 | Jun | news_2024-07-15_20.jpg | \images\news_2024-07-15_20.jpg | https://www.vishay.com/ | vishay.com |
| Medium Voltage for Resource Efficiency in PV Plants | Enormous quantities of raw materials are required ... | 12021 | Industry News | Medium Voltage for Resource Efficiency in PV Plants | Enormous quantities of raw materials are required for the conversion of the energy system, for example, in the form of copper and aluminum cables to connect renewable generators to the grid. One promising approach to save raw materials is to move from the low to the medium-voltage level in renewable energy power plants. The Fraunhofer Institute for Solar Energy Systems ISE sees a huge potential for savings with higher system voltages, especially in large PV power plants. The institute is planning first pilot power plants with this technology and is aiming for a broad market launch together with industry. To kick-off its research topic "Medium Voltage – A Resource-Efficient Way to Interconnect", Fraunhofer ISE presented a medium-voltage PV string inverter and a medium-voltage battery inverter at the Smarter E trade fair in Munich. The move to medium voltage (MV) was first made possible by the development of high voltage silicon carbide (SiC) components with high switching speeds. SiC components up to 3.3 kV are now available on the market. In 2023, Fraunhofer ISE developed the world's first medium-voltage photovoltaic (MS-PV) string inverter in the "MS-LeiKra" project and successfully put it into operation on the grid. The two-stage inverter has an output voltage of 1,500 V<sub>AC</sub> at a power of 250 kVA. | 19.06.2024 11:00:00 | Jun | news_2024-07-15_6.jpg | \images\news_2024-07-15_6.jpg | https://www.ise.fraunhofer.de/en/press-media/press-releases/2024/fraunhofer-ise-goes-with-medium-voltage-for-resource-efficiency-in-pv-plants.html | ise.fraunhofer.de |
| SiC Manufacturing Facility planned to be built in Czech Republic | onsemi announced plans to establish a state-of-the... | 11978 | Industry News | SiC Manufacturing Facility planned to be built in Czech Republic | onsemi announced plans to establish a state-of-the-art, vertically integrated silicon carbide (SiC) manufacturing facility in the Czech Republic. The site would produce the company’s intelligent power semiconductors that are essential for improving the energy efficiency of applications in electric vehicles, renewable energy and AI data centers. onsemi’s plan to expand SiC manufacturing with a multi-year brownfield investment of up to $2 billion (44 billion CZK) is part of the company’s previously disclosed long-term capital expenditure target. This investment would build on the company’s current operations in the Czech Republic, which include silicon crystal growth, silicon and silicon carbide wafer manufacturing (polished and EPI) and a silicon wafer fab. Today, the site can produce more than three million wafers annually, including more than one billion power devices. Upon completion, the operation would contribute annually more than $270 million USD (6 billion CZK) to the country’s GDP. Pending all final regulatory and incentive approvals, this would be one of the largest private sector investments in the Czech Republic’s history and would further contribute to the prosperity and economic dynamism of the Zlín region. | 19.06.2024 08:00:00 | Jun | news_2024-07-01_2.jpg | \images\news_2024-07-01_2.jpg | https://www.onsemi.com/company/news-media/press-announcements/en/onsemi-selects-the-czech-republic-to-establish-end-to-end-silicon-carbide-production-for-advanced-power-semiconductors | onsemi.com |
| Partnering in EMC Solutions for Aerospace, Defense and Medical Electronics | Anritsu Company has partnered with Y.I.C. Technolo... | 11983 | Industry News | Partnering in EMC Solutions for Aerospace, Defense and Medical Electronics | Anritsu Company has partnered with Y.I.C. Technologies to develop tools that support companies performing EMC pre-compliance measurements. Anritsu’s Field Master spectrum analyzers compliment the Y.I.C EMScanners and EMViewer application software to provide a fully integrated solution. Design engineers developing advanced electronics face increased EMC challenges from high-speed data circuits and RF components. Efficient design processes necessitate early insight into the EMC performance of the circuits. The Y.I.C scanners and EMViewer software coupled with Anritsu spectrum analyzers provide a 3D heat map of all radiated signals. Circuit layout and shielding materials can be optimized before submitting the product to a certified test house, maximizing the chances of a first-time pass and minimizing repeated submissions. | 18.06.2024 13:00:00 | Jun | news_2024-07-01_7.jpg | \images\news_2024-07-01_7.jpg | https://www.anritsu.com/en-gb/test-measurement/news/news-releases/2024/2024-00-18-gb01 | anritsu.com |
| Power Tradeshow in Shenzhen, China | PCIM Asia, the exhibition and conference for power... | 11979 | Event News | Power Tradeshow in Shenzhen, China | PCIM Asia, the exhibition and conference for power electronics, intelligent motion, renewable energy and energy management, will return to the Shenzhen World Exhibition and Convention Center from 28 – 30 August 2024. More than 80% of available booth space has already been reserved at the event’s 2024 edition, as exhibitors look to highlight their latest advancements across a wide range of market segments including e-mobility, clean energy and energy storage, wide-bandgap (WBG) devices and more. The event will facilitate industry discussion on these high-growth application areas through a series of themed forums, as well as through its industry-leading conference program. At PCIM Asia 2024, participants will find these trends and technologies explored across multiple channels, including on the exhibition floor, through a series of forums and at the PCIM Asia Conference. The event brings together industry stakeholders from throughout the power electronics supply chain – from manufacturers and suppliers to researchers and industry experts – to network, share expertise and discover new products and solutions. Alongside the main exhibition, PCIM Asia hosts a selection of concurrent forums that provide additional opportunities for learning and interaction. The Exhibitor Forums provide a platform for exhibitors to promote their latest technologies, while the Industry Forums feature invited speakers, including researchers and subject matter experts, who discuss developments, innovations and challenges in the power electronics field across selected application areas. PCIM Asia is jointly organised by Guangzhou Guangya Messe Frankfurt Co Ltd and Mesago Messe Frankfurt GmbH. | 18.06.2024 09:00:00 | Jun | news_2024-07-01_3.jpg | \images\news_2024-07-01_3.jpg | https://pcimasia-expo.cn.messefrankfurt.com/shenzhen/en/press/press-releases/2024/PCIM24_PR2.html | pcimasia-expo.cn |
| High-density Power Modules for Deep-Sea ROVs | Historically, commercial divers have taken great r... | 11977 | Industry News | High-density Power Modules for Deep-Sea ROVs | Historically, commercial divers have taken great risks to inspect oil and gas pipelines, high-voltage electrical cables, wind turbines and other critical infrastructure deep undersea. Saab has eliminated that risk bringing deep-sea exploration expertise to commercial underwater applications. With a mission to keep people and society safe, the Seaeye range of ROVs has been developed with more agile and modular systems designs. Saab UK’s Seaeye systems are capable of performing a wide range of tasks from observation and inspection to more complex functions like underwater maintenance. This evolution has culminated in the development of a system which is claimed to be “the world's most advanced all-electric work-class ROV (eWROV)”, which combines versatility and maneuverability. Unlike traditional hydraulic ROVs, the eWROV eliminates the need for large amounts of hydraulic fluid, thereby mitigating environmental risks. Critical specifications for the eWROV’s power converter are size, mass and thermal dissipation, given that the electronic systems are housed in sealed enclosures where space is at a premium and conventional convection cooling is not possible. To meet these requirements, Saab chose Vicor power modules for their high density and efficiency. These modules enable efficient power distribution to various eWROV subsystems such as thrusters, manipulators and onboard electronics. The use of Vicor power modules allows Saab to customize Seaeye subsystems according to specific industry-standard 24V and 48V levels required by onboard computers, sensors, video cameras, lights and navigation equipment. | 18.06.2024 07:00:00 | Jun | news_2024-07-01_1.jpg | \images\news_2024-07-01_1.jpg | https://www.vicorpower.com/press-room/saab-seaeye | vicorpower.com |
| SIC Research Cooperation between Industry and University | Sanan Semiconductor has entered into a Research Pa... | 12055 | Industry News | SIC Research Cooperation between Industry and University | Sanan Semiconductor has entered into a Research Partnership with the Institute for Power Electronics (LEE) at FAU Erlangen-Nürnberg university. This research will focus on advanced innovation in power electronic systems focusing on SiC technology. "Sanan Semiconductor is a vertically integrated SiC supplier with inhouse development and manufacturing of SiC substrates, epitaxial wafers, Diode/MOSFET dies and packaged products. This partnership with one of Germany's leading research institutes for SiC puts Sanan Semiconductor in a strong position", says Mr. Tony Chiang, CEO of Sanan Semiconductor. Dr. Ming-Che Kao, General Manager of Sanan Europe comments: "Europe is a key market for us, and this partnership aims at strengthening our system innovation." Dr. Ajay Poonjal Pai, Head of WBG Innovation, adds: "Compared to traditional Silicon-based technologies, SiC offers significant efficiency and power density improvements in various applications. Despite the increasing adoption of SiC in power electronic applications, several system-level barriers still inhibit the full potential of SiC. This collaboration is a step towards overcoming these barriers." Prof. Martin März, Director of the institute says, "We are pleased to have a strong partner in Sanan, whose innovative SiC devices will enable us to advance into new performance regions." | 14.06.2024 06:00:00 | Jun | news_2024-08-15_1.jpg | \images\news_2024-08-15_1.jpg | https://www.lee.tf.fau.de/2024/06/14/research-partnership-with-sanan/ | lee.tf.fau.de |
| Rugged 650 V and 1200 V IGBTs | WeEn Semiconductors has introduced IGBTs with volt... | 12033 | Product Release | Rugged 650 V and 1200 V IGBTs | WeEn Semiconductors has introduced IGBTs with voltage ratings of 650 V and 1200 V, which incorporate a fast recovery anti-parallel diode and show “extremely low leakage currents and exceptional conduction and switching characteristics at both high and low junction temperatures”, the company says. Based on fine trench gate field-stop (FS) technology, the IGBTs are said to provide a more uniform electric field within the chip, support higher breakdown voltages and offer improved dynamic control. WeEn claims that the devices offer “optimum trade-off between conduction and switching losses, as well as an enhanced EMI design”. The IGBTs offer ratings of 650V/75A, 1200V/40A and 1200V/75A and are supplied in TO247 or TO247-4L packages depending on the selected device. All of the devices will operate with a maximum junction temperature (T<sub>j</sub>) of 175 °C and have undergone high-voltage H3TRB (high-humidity, high-temperature and high-voltage reverse bias) and 100%-biased HTRB (high-temperature reverse bias) tests up to this maximum. Target applications include solar inverters, motor control systems, uninterruptible power supplies (UPS) and welding. A positive temperature coefficient simplifies parallel operation in applications where higher performance is required, while options for bare die, discrete and module product variants provide flexibility for a wide variety of target designs. | 12.06.2024 14:30:00 | Jun | news_2024-07-15_18.jpg | \images\news_2024-07-15_18.jpg | https://www.ween-semi.com/en/cat/igbt | ween-semi.com |
| BLDC Motor Hardware-Software Combo | Power Integrations complemented its hardware-softw... | 11995 | Product Release | BLDC Motor Hardware-Software Combo | Power Integrations complemented its hardware-software bundle for brushless DC motors (BLDC) with BridgeSwitch™-2, a high-voltage integrated half-bridge (IHB) motor-driver IC family targeting applications up to 1 HP (746 W). The ICs, which feature high- and low-side drivers and advanced FREDFETs with integrated lossless current sensing, deliver inverter efficiency of up to 99 percent. The IHB architecture eliminates hot spots, which increases design flexibility and reliability, slashes component count and saves PCB area. BridgeSwitch-2 is supported by Power Integrations’ MotorXpert™ software suite which includes single-phase trapezoidal control and three-phase sensor-less Field Oriented Control (FOC) modules, speeding inverter development. BridgeSwitch-2 ICs handle operational exceptions in hardware, which permits the use of IEC 60730 Class A safety software, reducing certification time by months. Quiescent BLDC inverters can be ordered into sleep-mode, reducing driver power consumption to less than 10 mW; this leaves more power available under regulated standby power limits to be allocated for loads such as network access and monitoring. The IHB architecture reduces component count by 50 percent and PCB space by 30 percent over discrete designs by eliminating shunt resistors and associated signal conditioning circuits. Shunt losses are also eliminated, improving efficiency. Precise motor control is achieved with the built-in real-time reporting of phase current (IPH) information. Accurate turn-on/off gate drive and a soft-body diode result in a typical EMI profile 10 dB lower than existing drivers, so a smaller EMI filter can be selected. | 11.06.2024 14:30:00 | Jun | news_2024-07-01_19.jpg | \images\news_2024-07-01_19.jpg | https://investors.power.com/news/news-details/2024/Power-Integrations-Revs-Up-Motor-Drive-Offering-With-BridgeSwitch-2-BLDC-IC-Family/default.aspx | power.com |
| 2-in-1 SiC Molded Module | Rohm Semiconductor introduced four models as part ... | 11994 | Product Release | 2-in-1 SiC Molded Module | Rohm Semiconductor introduced four models as part of the TRCDRIVE pack™ series with 2-in-1 SiC molded modules (two 750V-rated, BSTxxxD08P4A1x4; two 1200V-rated, BSTxxxD12P4A1x1) optimized for electric vehicle traction inverters. TRCDRIVE pack supports up to 300 kW and features high power density and a unique terminal configuration, helping solve the key challenges of traction inverters in terms of miniaturization, higher efficiency, and fewer person-hours. A trademark brand for ROHM SiC molded type modules developed specifically for traction inverter drive applications, TRCDRIVE pack reduces size by utilizing a unique structure that maximizes heat dissipation area. In addition, ROHM’s 4th generation SiC MOSFETs with low ON resistance are built in, resulting in an “industry-leading power density” 1.5 times higher than that of general SiC molded modules, while contributing to the miniaturization of xEV inverters. The modules are also equipped with control signal terminals using press-fit pins, enabling easy connection by simply pushing the gate driver board from the top, considerably reducing installation time. In addition, low inductance (5.7 nH) is achieved by maximizing the current path and utilizing a two-layer bus-bar structure for the main wiring, contributing to lower losses during switching. Despite developing modules, Rohm has established a mass production system similar to discrete products, making it possible to increase production capacity by 30 times compared to conventional SiC case-type modules. | 11.06.2024 13:30:00 | Jun | news_2024-07-01_18.jpg | \images\news_2024-07-01_18.jpg | https://www.rohm.com/news-detail?news-title=2024-06-11_news_trcdrive-pack&defaultGroupId=false | rohm.com |
| 16/24-Channel Automotive LED Driver | Novosense Microelectronics has developed the 16/24... | 12032 | Product Release | 16/24-Channel Automotive LED Driver | Novosense Microelectronics has developed the 16/24-channel driver IC NSL21916/24 for automotive LED applications. It offers a variety of driving options for up to 16/24 channels and features flexible dimming and control capabilities. Target applications include rear lights, exterior lights and general automotive interior and body lighting. At PCIM 2024, NOVOSENSE provided a live demonstration of the IC in a rear lighting application. Qualified to AEC-Q100 Grade 1(T<sub>j</sub> from -40 °C to 150 °C), the NSL21916/24 supports individual control and high-side currents of up to 100 mA for each channel. A 2-bit global and 6-bit individual current setting combined with 12-bit independent PWM dimming and phase shift PWM dimming capabilities enable LED brightness control. On-board programmable EEPROM allows the same device to be configured for different applications, while a built-in UART/ digital interface supports several control and diagnostic functions. Addition of a standard CAN physical layer allows this interface to be used for long-distance, off-board communications without any impact on EMC. The NSL21916/24 is supplied in a HTSSOP38 package, has a dropout voltage of 600 mV max. (@ 50 mA) and provides multiple regulation with LED open-circuit, LED short-to-ground and single LED short-circuit diagnostics. | 11.06.2024 13:30:00 | Jun | news_2024-07-15_17.jpg | \images\news_2024-07-15_17.jpg | https://www.novosns.com/en/company-news-307 | novosns.com |
| “Industry’s first GaN IPM” | Texas Instruments introduced “the industry’s first... | 11993 | Product Release | “Industry’s first GaN IPM” | Texas Instruments introduced “the industry’s first 650 V three-phase GaN IPM for 250 W motor drive applications”. The GaN IPM addresses many of the design and performance compromises engineers typically face when designing major home appliances and heating, ventilation and air-conditioning (HVAC) systems. The DRV7308 GaN IPM, which is integrated in a 12mm-by-12mm package, enables more than 99% inverter efficiency, optimized acoustic performance, reduced solution size and lower system costs. In addition, the DRV7308 is claimed to achieve “industry-low dead time and low propagation delay, both less than 200ns, enabling higher pulse-width modulation (PWM) switching frequencies that reduce audible noise and system vibration”. This also reduces motor heating, which can improve reliability and extend the lifetime of the system. | 11.06.2024 12:30:00 | Jun | news_2024-07-01_17.jpg | \images\news_2024-07-01_17.jpg | https://news.ti.com/2024-06-11-TI-unveils-industrys-first-GaN-IPM-to-enable-smaller,-more-energy-efficient-high-voltage-motors | ti.com |
| 1700V SiC Schottky Discretes and Dual Diode Modules | Semiq has announced the addition of 1700 V SiC Sch... | 11990 | Product Release | 1700V SiC Schottky Discretes and Dual Diode Modules | Semiq has announced the addition of 1700 V SiC Schottky discrete diodes and dual diode packs to its QSiC™ product line. The GP3D050B170X (bare die) and GP3D050B170B (TO-247-2L package) discrete diode is rated for respective maximum forward currents of 110 A and 151 A. Device design supports easy parallel configurations, enhancing flexibility and scalability for various power applications. The new devices meet the size and power demands of a wide range of demanding applications including switched-mode power supplies, uninterruptible power supplies (UPS), induction heaters, welding equipment, DC/DC converters, solar inverters and electric vehicle (EV) charging stations. Featuring zero reverse recovery current and near-zero switching loss, Semiq’s 1700 V SiC Schottky diode technologies offer enhanced thermal management that reduces the need for cooling. As a result, engineers can implement highly efficient, high-performance designs that minimize system heat dissipation, allow the use of smaller heatsinks and lead to cost and space savings. All of the new products support fast switching across operating junction temperatures (T<sub>j</sub>) of -55 °C to 175 °C. | 11.06.2024 09:30:00 | Jun | news_2024-07-01_14.jpg | \images\news_2024-07-01_14.jpg | https://semiq.com/pcim-2024-semiq-introduces-1700v-sic-schottky-discretes-and-dual-diode-modules/ | semiq.com |
| One Channel Power Supply for Current Transducers | Danisense has launched a compact size one channel ... | 12028 | Product Release | One Channel Power Supply for Current Transducers | Danisense has launched a compact size one channel power supply suitable for its DT, DS, DN and DM series of current transducers. The DSSIU-1 power supply is specified with dimensions of 130 mm x 116 mm x 56 mm, +/- 15 V supply voltage and 1.2 A DCCT nominal current. The position of DSUB and banana connectors on the front side facilitates the set-up. The DSSIU-1 power supply already features TEDS functionality for the next generation of current transducers allowing automatic set-up with compatible instruments. | 11.06.2024 09:30:00 | Jun | news_2024-07-15_13.jpg | \images\news_2024-07-15_13.jpg | https://danisense.com/news/danisense-launches-compact-size-one-channel-power-supply/ | danisense.com |
| Inverter Reference Design (almost) ready for Vehicle Integration | CISSOID is introducing the EVK-PLA1060 series of O... | 12027 | Product Release | Inverter Reference Design (almost) ready for Vehicle Integration | CISSOID is introducing the EVK-PLA1060 series of On-Board Inverter Reference Designs which are said to be a complete solution, conceived for integration into vehicles about to undergo in-vehicle and field testing, drastically reducing the time required for system development. Featuring a compact and lightweight, yet robust aluminum housing, the EVK-PLA1060 offers direct vehicle mounting with lower design effort. Furthermore, the motor control software allows customization and configuration by the user for additional process simplification. Driving the product’s functionality is Silicon Mobility’s OLEA® T222 FPCU (Field Programmable Control Unit). The programmable hardware of the T222 processor enables fast control loops and high switching frequencies, combined with the OLEA APP - T222 inverter control software. Both the OLEA T222 processor and OLEA APP - T222 inverter software carry ISO26262 ASIL-D and AUTOSAR 4.3 certification, while the ISO26262 certification of CISSOID’s ICMs (Inverter Control Modules) is currently in progress. The EVK-PLA1060 is configurable and customizable as required. It consists of a power module, the control board, a low ESL DC-link capacitor, an EMC filter and current sensors. The EVK-PLA1060 provides a power range of 100 to 350 kW, at a 100 to 850 V operating bus voltage - for a power density up to 52 kW/l. | 11.06.2024 08:30:00 | Jun | news_2024-07-15_12.jpg | \images\news_2024-07-15_12.jpg | http://www.cissoid.com/news/cissoid-ingenuity-facilitates-faster-inverter-development-24 | cissoid.com |
| Isolated probing system for precise measurements of fast switching signals | Rohde & Schwarz has developed the R&S RT-ZISO isol... | 11989 | Product Release | Isolated probing system for precise measurements of fast switching signals | Rohde & Schwarz has developed the R&S RT-ZISO isolated probing system. The R&S RT-ZISO enables accurate measurements of fast switching signals, especially in environments with high common-mode voltages and currents. Also new is the R&S RT-ZPMMCX passive probe with MMCX connector, which complements the isolated probe system perfectly for certain measurement tasks. The company claims that “the R&S RT-ZISO will set new standards in isolated probe technology, delivering unprecedented accuracy, sensitivity, dynamic range, and bandwidth for next generation wide bandgap (WBG) power designs with SiC and GaN”. The R&S RT-ZISO provides differential measurements of up to ±3 kV on reference voltages of ±60 kV with a rise time of < 450 ps and suppresses fast common-mode signals that can distort and interfere with accurate measurements. Its power-over-fiber architecture galvanically isolates the device under test (DUT) from the measurement setup, providing a much higher common-mode rejection ratio (CMRR) than conventional differential probes. Its key features include bandwidth options of 100 MHz to 1 GHz (upgradeable), a CMRR of > 90 dB (> 30 000:1) at 1 GHz, an input and offset range of ±3 kV, a common mode range of ±60 kV, and a sensitive input range of ±10 mV. | 11.06.2024 08:30:00 | Jun | news_2024-07-01_13.jpg | \images\news_2024-07-01_13.jpg | https://www.rohde-schwarz.com/uk/about/news-press/all-news/rohde-schwarz-presents-r-s-rt-ziso-isolated-probing-system-for-precise-measurements-of-fast-switching-signals-press-release-detailpage_229356-1503305.html | rohde-schwarz.com |
| Design Kit for Power over Ethernet | Bourns has introduced the POE-LAB1 Design Kit, cre... | 11988 | Product Release | Design Kit for Power over Ethernet | Bourns has introduced the POE-LAB1 Design Kit, created to help streamline both the designing of power/data delivery and protection in Power over Ethernet (PoE) applications. The kit includes components from Bourns’ portfolio of semiconductor and magnetic products that are particularly suited to support high-speed Ethernet lines (up to 10 GbE) with PoE++ (Type 4) capabilities. This kit provides a synergistic approach that gives developers a resource with several options for their PoE designs that can satisfy a variety of power/data delivery and protection requirements. The Bourns® POE-LAB1 Design Kit comes with 32 different products. This allows designers to evaluate how multiple product combinations can meet various PoE application specifications by using one single design kit. The Bourns® products in the kit are comprised of Ethernet transformers, DC/DC conversion transformers, a common mode choke, ferrite beads, single and bridge Schottky rectifier diodes, high-speed protectors, diode arrays and TVS diodes. | 11.06.2024 07:30:00 | Jun | news_2024-07-01_12.jpg | \images\news_2024-07-01_12.jpg | https://www.bourns.com/news/press-releases/pr/2024/06/11/bourns-releases-poe-lab1-design-kit-to-help-streamline-power-data-delivery-and-protection-designs-in-power-over-ethernet-applications | bourns.com |
| GaN Devices with “lowest ever On-Resistance” | Cambridge GaN Devices (CGD) has launched its “lowe... | 12026 | Product Release | GaN Devices with “lowest ever On-Resistance” | Cambridge GaN Devices (CGD) has launched its “lowest ever on-resistance (RDS(on)) parts” which have been engineered with a new die and new packages to deliver the benefits of GaN to high-power applications such as data centers, inverters, motor drives and other industrial power supplies. ICeGaN™ P2 series ICs feature RDS(on) levels down to 25 mΩ, supporting multi kW power levels. Incorporating an on-chip Miller Clamp to eliminate shoot-through losses during fast switching and implementing 0 V turn off to minimize reverse conduction losses, ICeGaN ICs are said to “outperform discrete e-Mode GaN and other incumbent technologies”. The best thermal resistance is specified 0.28 K/W, which is claimed to be “again, equivalent or better than anything else currently available on the market”. The dual-gate pinout of the dual side DHDFN-9-1 (Dual Heat-spreader DFN) package with wettable flanks facilitates paralleling for scalability, also enabling multi kW applications. The family includes four devices with RDS(on) levels of 25 mΩ and 55 mΩ, rated at 60 A and 27 A, in 10 mm x 10 mm footprint DHDFN-9-1 and BHDFN-9-1 (Bottom Heat-spreader DFN) packages. In common with all CGD ICeGaN products, the P2 series can be driven using any standard MOSFET or IGBT driver. | 11.06.2024 07:30:00 | Jun | news_2024-07-15_11.jpg | \images\news_2024-07-15_11.jpg | https://www.camgandevices.com/en/p/new-gan-power-icegan-ics-enable-the-highest-efficiency-levels-for-data-centres-inverter-and-industrial-smps/ | camgandevices.com |
| Complete Design for an On-Board Charger Solution | Microchip Technology has announced an On-Board Cha... | 12031 | Product Release | Complete Design for an On-Board Charger Solution | Microchip Technology has announced an On-Board Charger (OBC) solution that uses a selection of its automotive-qualified digital, analog, connectivity and power devices, including the dsPIC33C Digital Signal Controller (DSC), the MCP14C1 isolated SiC gate driver and mSiC™ MOSFETs in an industry-standard D2PAK-7L XL package. This solution is designed to increase an OBC system’s efficiency and reliability. To further simplify the supply chain for customers, the company provides the key technologies that support the other functions of an OBC, including communication interfaces, security, sensors, memory and timing. To accelerate system development and testing, Microchip offers a flexible programmable solution with ready-to-use software modules for Power Factor Correction (PFC), DC/DC conversion, communication and diagnostic algorithms. The software modules in the dsPIC33 DSC are designed to optimize performance, efficiency and reliability, while offering flexibility for customization and adaptation to specific OEM requirements. The dsPIC33C DSC and the MCP14C1 isolated SiC gate driver are AEC-Q100 qualified, and the mSiC MOSFET is AEC-Q101-qualified. The dsPIC33C DSC is an AUTOSAR-ready device and is supported by the MPLAB® development ecosystem including MPLAB PowerSmart Development Suite. | 10.06.2024 12:30:00 | Jun | news_2024-07-15_16.jpg | \images\news_2024-07-15_16.jpg | https://www.microchip.com/en-us/about/news-releases/products/microchip-makes-it-easier-to-design-on-board-charger-solution | microchip.com |
| Strategic Current Sensor Chip Supplier | EV manufacturer NIO selected Melexis' current sens... | 11946 | Industry News | Strategic Current Sensor Chip Supplier | EV manufacturer NIO selected Melexis' current sensor chips for their traction inverter systems. Melexis' chips will power all of NIO's battery electric vehicles (BEVs). Through this collaboration, NIO will use from Melexis' current sensor technology, enhancing the efficiency and reliability of their traction inverter systems. Additionally, Melexis provides local support with dedicated engineers to ensure seamless integration and optimization. Dieter Verstreken, VP of China Strategy at Melexis, commented, "We are delighted to collaborate with NIO, a company known for its innovation and leadership. Our current sensor ICs, coupled with the expertise of our dedicated local engineers, will provide NIO with the support they need to achieve success in the electric vehicle market. We look forward to collaborating with NIO on future projects to advance electric vehicle technology." | 06.06.2024 14:00:00 | Jun | news_2024-06-15_9.jpg | \images\news_2024-06-15_9.jpg | https://www.melexis.com/en/news/2024/06jun2024-nio-selects-melexis-as-a-strategic-current-sensor-chip-supplier | melexis.com |
| Renewal of Cooperation Agreement for Packaging Technology | Vincotech has renewed its cooperation agreement wi... | 11945 | Industry News | Renewal of Cooperation Agreement for Packaging Technology | Vincotech has renewed its cooperation agreement with Semikron Danfoss. The two enterprise's alliance, which dates back to 2003, has been extended to further strengthen MiniSKiiP® package technology. Multiple source options for the package to further mitigate the supply chain risk, and standards-compliant design are just a few of the benefits of this renewed cooperation agreement. Featuring service-friendly spring contacts, MiniSKiiP's unique hardware is in mass production for use in motor drives, servo drives, and power supplies. Vincotech and Semikron Danfoss are now set to take MiniSKiiP's reliability and standardization to the next level. Customers can look forward this tech bringing even greater robustness, versatility, and compatibility for their power electronics solutions. | 06.06.2024 13:00:00 | Jun | news_2024-06-15_8.jpg | \images\news_2024-06-15_8.jpg | https://www.vincotech.com/news/product-news/article/vincotech-and-semikron-danfoss-renew-cooperation-agreement-for-miniskiipr-packaging-technology.html | vincotech.com |
| Online Custom Magnetics Design House launches global Production Service | Frenetic Electronics announced Frenetic Factory, a... | 11944 | Industry News | Online Custom Magnetics Design House launches global Production Service | Frenetic Electronics announced Frenetic Factory, a worldwide magnetics production facility with plants in the USA, Mexico, Europe, India, and China. Frenetic Factory can deliver samples quickly with no MOQs. It currently has a production capacity of 8.75M units annually, that can be scaled to even higher volumes fast. Frenetic launched its magnetics design service in 2021. Using an online process and Core Optimizer tool to make the core selection process faster and more efficient, users input their electrical and environmental specifications, and receive an optimized transformer design in minutes by using Frenetic's custom algorithms. The company's web-based platform allows users to compare millions of different magnetics possibilities within seconds. BOMs, 3D models and engineering drawings are automatically generated. Now, users can take that design and have samples and full production quantities made at Frenetic Factory. Frenetic Factory comprises facilities around the world that are both owned by Frenetic Magnetics or a qualified third party. This is the same operational model as much of the rest of the electronic components industry. And Frenetic Factory is fully responsible for the technical support and quality of the components it supplies, no matter which facility they were produced in. Manufacturing quality and product standards adhered to include MIL-STD-461E, MIL-STD-981, ESCC 3201 and Qualified Parts, and AEC-Q200. | 06.06.2024 12:00:00 | Jun | news_2024-06-15_7.jpg | \images\news_2024-06-15_7.jpg | https://frenetic.ai/ | frenetic.ai |
| IWIPP 2025 Call for Papers | The organizing committee is pleased to announce th... | 12022 | Event News | IWIPP 2025 Call for Papers | The organizing committee is pleased to announce that the Call for Papers for IWIPP 2025 is now available. The online portal for abstract submission will open September 1, 2024, and the deadline for submission is November 1, 2024. IWIPP 2025 technical abstracts are submitted in a compact format consisting of a single-page technical description and a second page of figures. IWIPP 2025 will be held April 8-10, 2025, on the campus of University of Alabama, Tuscaloosa, USA. The content of IWIPP 2025 will include a set of keynote addresses from leading power technology experts, a broad range of technical sessions, as well as extensive networking opportunities. All of this is included in the workshop registration fee. | 06.06.2024 12:00:00 | Jun | news_2024-07-15_7.jpg | \images\news_2024-07-15_7.jpg | https://iwipp.org/conference/call-for-papers-2025/ | iwipp.org |
| Global Production Service for Custom Magnetics designed online | Using an online process and special Core Optimizer... | 12029 | Product Release | Global Production Service for Custom Magnetics designed online | Using an online process and special Core Optimizer™ tool to make the core selection process faster and more efficient, users input their electrical and environmental specifications, and receive an optimized transformer design in minutes – this is basically, what Frenetic’s custom algorithms enable. The company’s web-based platform allows users to compare millions of different magnetics possibilities within seconds, “while maintaining the highest level of accuracy.”, the company says. BOMs, 3D models and engineering drawings are automatically generated. Now, users can take that design and have samples and full production quantities made at Frenetic Factory, which comprises facilities around the world that are both owned by Frenetic Magnetics or a qualified third party. This is the same operational model as much of the rest of the electronic components industry. And Frenetic Factory is fully responsible for the technical support and quality of the components it supplies, no matter which facility they were produced in. Manufacturing quality and product standards adhered to include MIL-STD-461E, MIL-STD-981, ESCC 3201 and Qualified Parts, and AEC-Q200. Core types available include ferrite, powder, amorphous, electrical steel and nanocrystalline; shapes include round, Litz, foil, planar and Cu-stamped. | 06.06.2024 10:30:00 | Jun | news_2024-07-15_14.jpg | \images\news_2024-07-15_14.jpg | https://factory.frenetic.ai/ | factory.frenetic.ai |
| Expanded SMT and Module Package Options for 1200 V SiC MOSFETs | Alpha and Omega Semiconductor (AOS) announced the ... | 11987 | Product Release | Expanded SMT and Module Package Options for 1200 V SiC MOSFETs | Alpha and Omega Semiconductor (AOS) announced the expansion of their package portfolio options available for their second generation 650 V to 1200 V αSiC MOSFETs. Applicable to many critical applications such as xEV charging, solar inverters, and industrial power supplies, the package selections give designers the added flexibility of multiple system optimization options to further maximize system efficiency. The first new surface mount package is available for the AOBB040V120X2Q, AOS’ new 1200 V/40 mOhm αSiC MOSFET in a standard D2PAK-7L surface mount package. This AEC-Q101 qualified product is designed to replace traditional through-hole packages. It is suited for applications such as on-board chargers (OBCs) where efficient cooling can be provided by vias and backside PCB heatsinks, simplifying the assembly flow and maximizing the power density. Furthermore, AOS is releasing its GTPAK™ surface mount package with topside cooling features. In designs where a topside-mounted heatsink is viable, the direct heat path from the GTPAK minimizes the thermal resistance. It enables higher power dissipation for more effective PCB routing. The first AOS product in GTPAK is the AOGT020V120X2. This 1200 V/20 mOhm αSiC MOSFET meets the requirements of high-efficiency solar inverter and industrial power supply applications. | 06.06.2024 06:30:00 | Jun | news_2024-07-01_11.jpg | \images\news_2024-07-01_11.jpg | https://www.aosmd.com/sites/default/files/2024-06/AOS_SiC_MOSFET_Packages_PR.pdf | aosmd.com |
| Combination of Silicon Trench and SiC MOSFETs | As data centers become increasingly power-hungry t... | 11992 | Product Release | Combination of Silicon Trench and SiC MOSFETs | As data centers become increasingly power-hungry to support the tremendous processing requirements of AI workloads, the need for boosting energy efficiency is paramount. The combination of onsemi’s latest generation T10® PowerTrench family and EliteSiC 650V MOSFETs create a solution that offers high efficiency and high thermal performance in a smaller footprint for data center applications. Using the T10 PowerTrench family and EliteSiC 650V solution, data centers are able to reduce power losses that occur by an estimated 1%. If implemented in data centers globally, the solution could reduce energy consumption by 10 TWh annually or the equivalent of the energy required to fully power nearly one million homes per year. The R<sub>DS(on)</sub> is less than 1 Milliohm. The T10 PowerTrench Family also meets the stringent standards required for automotive applications. The combined solution also meets the stringent Open Rack V3 (ORV3) base specification required by hyperscale operators to support the next generation of high-power processors. | 05.06.2024 11:30:00 | Jun | news_2024-07-01_16.jpg | \images\news_2024-07-01_16.jpg | https://www.onsemi.com/company/news-media/press-announcements/en/onsemi-unveils-complete-power-solution-to-improve-energy-efficiency-for-data-centers | onsemi.com |
| CoolGaN™ bidirectional Switch and CoolGaN Smart Sense | Infineon Technologies announced two CoolGaN™... | 11949 | Product Release | CoolGaN™ bidirectional Switch and CoolGaN Smart Sense | Infineon Technologies announced two CoolGaN™ product technologies, CoolGaN bidirectional switch (BDS) and CoolGaN Smart Sense. CoolGaN BDS is said to provide "exceptional soft- and hard-switching behavior", with bidirectional switches available at 40 V, 650 V and 850 V. Target applications of this family include mobile device USB ports, battery management systems, inverters, and rectifiers. The CoolGaN Smart Sense products feature lossless current sensing, simplifying design and further reducing power losses, as well as transistor switch functions integrated into one package. They are ideal for usage in consumer USB-C chargers and adapters. The CoolGaN BDS high voltage feature a true normally-off monolithic bi-directional switch with four modes of operation. Based on the gate injection transistor (GIT) technology, the devices have two separate gates with substrate terminal and independent isolated control. The devices are suited for back-to-back switches in single-phase H4 PFC and HERIC inverters and three-phase Vienna rectifiers as well as for single-stage AC power conversion in AC/DC or DC/AC topologies. The CoolGaN BDS 40 V is a normally-off, monolithic bi-directional switch based on Infineon's in-house Schottky Gate GaN technology. It can block voltages in both directions, and through a single-gate and common-source design, it is optimized to replace back-to-back MOSFETs used as disconnect switches in battery-powered consumer products. | 05.06.2024 08:30:00 | Jun | news_2024-06-15_12.jpg | \images\news_2024-06-15_12.jpg | https://www.infineon.com/cms/en/about-infineon/press/market-news/2024/INFPSS202406-111.html | infineon.com |
| Precise Power Resistors in 1206 and 1213 Packages for up to 90 A | In relation to their small size, the resistors in ... | 12034 | Product Release | Precise Power Resistors in 1206 and 1213 Packages for up to 90 A | In relation to their small size, the resistors in the WAx series from Isabellenhuette measure relatively high currents. Resistance values from 2 mOhm were already possible with the FMx series. With the new WAK (size 1206) and WAF (size 1213) resistors, the company can also offer resistance values of 1 and 0.5 mOhm. The WAF with a resistance value of 0.75 mOhm is also currently under development. These low-resistance values are made possible by the production process of roll cladding. In this process, a copper strip and a strip made from one of the company's own resistance alloys, Manganin or Zeranin, are rolled together to form a mechanically very stable duo strip. The final component geometry is then punched out of the duo strip – resulting in a size for the WAF component of 3.1 mm x 3.3 mm; the WAK is only half the size. The resistor alloys used to manufacture the WAx resistors are said to ensure high long-term stability, a very good temperature coefficient and a high load capacity with low inductance of less than 0.5 nH. All components are AEC-Q200 qualified and are with an initial tolerance of ±1 % for contious currents up to 90 A. | 04.06.2024 15:30:00 | Jun | news_2024-07-15_19.jpg | \images\news_2024-07-15_19.jpg | https://www.isabellenhuette.de/en/precision-and-power-resistors | isabellenhuette.de |
| Automotive OEM and Semiconductor Manufacturer: Long-Term SiC Supply Agreement and Joint Lab | STMicroelectronics (ST) and Geely Auto have signed... | 11985 | Industry News | Automotive OEM and Semiconductor Manufacturer: Long-Term SiC Supply Agreement and Joint Lab | STMicroelectronics (ST) and Geely Auto have signed a long-term Silicon Carbide supply agreement to accelerate their existing cooperation on SiC devices. Under the terms of this multi-year contract, ST will provide multiple Geely Auto brands with SiC power devices for mid-to-high-end battery electric vehicles (BEVs). In addition, building on their longstanding cooperation across multiple automotive applications, Geely and ST have established a joint lab to exchange information and explore solutions related to automotive Electronics/Electrical (E/E) architectures (i.e. in-vehicle infotainment, smart cockpit systems), ADAS, and NEVs. Geely Auto Group has adopted ST’s third generation SiC MOSFET devices in electric traction inverters. Geely Auto sold a total of 1.68 million vehicles in 2023, with NEV sales reaching 480,000 units, accounting for 28% of the company's total sales for the year. This NEV sales volume represents a year-over-year increase of 48%. | 04.06.2024 15:00:00 | Jun | news_2024-07-01_9.jpg | \images\news_2024-07-01_9.jpg | https://newsroom.st.com/media-center/press-item.html/t4631.html | st.com |
| Collaboration on SiC-Based Traction Inverters for Electric Vehicle Powertrains | NXP Semiconductors announced a collaboration with ... | 11939 | Industry News | Collaboration on SiC-Based Traction Inverters for Electric Vehicle Powertrains | NXP Semiconductors announced a collaboration with automotive tier-1 ZF Friedrichshafen on SiC-based traction inverter solutions for electric vehicles. Using NXP's GD316x high-voltage (HV) isolated gate drivers, the solutions are designed to accelerate the adoption of 800-V and SiC power devices. Safe, efficient and higher performance traction inverters enabled by the GD316x product family can be designed to extend EV range and reduce the number of charging stops while lowering system level costs for OEMs. As traction inverters now migrate to SiC-based designs, the SiC power devices need to be paired with HV isolated gate drivers to harness the advantages such as higher switching frequency, lower conduction losses, better thermal characteristics and higher robustness at high voltages, compared to previous generation silicon-based IGBT and MOSFET power switches. The GD316x family of functionally safe, isolated, high voltage gate drivers incorporates a number of programmable control, diagnostic, monitoring, and protection features, enhanced to drive the latest SiC power modules for automotive traction inverter applications. Its high level of integration allows a smaller footprint and simplifies the system design. The capabilities reduce Electromagnetic Compatibility (EMC) noise while also reducing switching energy losses for better efficiency. | 04.06.2024 07:00:00 | Jun | news_2024-06-15_2.jpg | \images\news_2024-06-15_2.jpg | https://www.nxp.com/company/about-nxp/nxp-and-zf-collaborate-on-sic-based-traction-inverters-to-boost-electric-vehicle-powertrains:NW-NXP-AND-ZF-COLLABORATE-ON-SIC-BASED | nxp.com |
| Multi-Channel Modular Power System | The instrument measurement world is about to get a... | 12047 | Product Release | Multi-Channel Modular Power System | The instrument measurement world is about to get another power supply test solution: the ultra-high power density IT2700 multi-channel modular power system from ITECH. The system integrates several test functions, the 1U main frame can include up to eight modules (200 W each) or four modules (50 0W each), including bidirectional DC power supply, DC power supply, and regenerative load module. This will allow users to flexibly combine according to specific test needs. The IT2700 multi-channel modular power system can be widely used in ATE integration in R&D, design verification and manufacturing of DC/DC converter, communication power semiconductors, 3C products, like smartphone, PCBA, battery simulation and test, chips BMS chips etc. | 31.05.2024 08:30:00 | May | news_2024-08-01_12.jpg | \images\news_2024-08-01_12.jpg | https://www.itechate.com/en/news/IT2700.html | itechate.com |
| The first fully integrated SiC Facility in Italy | STMicroelectronics intends to build a high-volume ... | 11938 | Industry News | The first fully integrated SiC Facility in Italy | STMicroelectronics intends to build a high-volume 200mm silicon carbide manufacturing facility for power devices and modules, as well as test and packaging, to be built in Catania, Italy. Combined with the SiC substrate manufacturing facility being readied on the same site, these facilities will form ST's Silicon Carbide Campus. The Silicon Carbide Campus will serve as the center of ST's global SiC ecosystem, integrating all steps in the production flow, including SiC substrate development, epitaxial growth processes, 200mm front-end wafer fabrication and module back-end assembly, as well as process R&D, product design, advanced R&D labs for dies, power systems and modules, and full packaging capabilities. This will achieve a first of a kind in Europe for the mass production of 200 mm SiC wafers with each step of the process – substrate, epitaxy & front-end, and back-end – using 200 mm technologies for enhanced yields and performances. The facility is targeted to start production in 2026 and to ramp to full capacity by 2033, with up to 15,000 wafers per week at full build-out. The total investment is expected to be around five billion euros, with a support of around two billion euros provided by the State of Italy within the framework of the EU Chips Act. | 31.05.2024 06:00:00 | May | news_2024-06-15_1.jpg | \images\news_2024-06-15_1.jpg | https://newsroom.st.com/media-center/press-item.html/c3262.html | st.com |
| Solving Design Challenges with Collaborative eBooks | Mouser Electronics has recently released several e... | 11984 | Industry News | Solving Design Challenges with Collaborative eBooks | Mouser Electronics has recently released several eBooks in collaboration with manufacturing partner Analog Devices (ADI). The eBooks focus on a wide range of topics, such as how production facilities can achieve greater productivity through a flexible manufacturing approach, the technologies being used to support sustainable manufacturing practices, embedded security concepts, and the technological advances in digital factories. In “<i>10 Experts on Flexible Manufacturing</i>”, subject matter experts from ADI and other technology companies discuss how today's sensors, robotic subsystems, and AI-enabled compute units allow factories to adapt fabrication and production with more flexibility. This enables production facilities to achieve greater throughput, product quality and cost-efficiency than ever before. At the same time, improved processes and control can help facilitate a more sustainable manufacturing process that wastes less energy and materials. The eBook also highlights many of ADI's products that help bring flexible manufacturing to life. In “<i>Engineering a More Sustainable Future: Redefining Industrial Efficiency in the Digital Age</i>”, experts from Mouser and ADI explore a wide range of topics related to industrial efficiency. The eBook features more than 10 articles, including a detailed analysis of motor encoders, a single-pair Ethernet condition monitoring vibration sensing solution, and the redesign of an RTD-based temperature sensor for the smart factory age. Several chapters include helpful infographics, as well as links to relevant products from ADI. | 30.05.2024 14:00:00 | May | news_2024-07-01_8.jpg | \images\news_2024-07-01_8.jpg | https://eu.mouser.com/newsroom/publicrelations-adi-ebook-showcase-2024final/ | mouser.com |
| LDO for ultra-miniature Applications | Toshiba Electronics has released of a series of lo... | 11953 | Product Release | LDO for ultra-miniature Applications | Toshiba Electronics has released of a series of low-dropout (LDO) voltage regulators in their ultra-miniature DFN4D package type. Specifically aimed at miniature applications powered by small-scale batteries, the family of devices reduces power consumption, thereby elongating the usable lifetime. With demand for battery powered IoT equipment/modules, communications modules, wearable devices, and other miniature equipment increasing, the LDO regulators of the TCR3LM series offer a line-up of over thirty devices spanning the voltage range 0.8 V DC to 5.0 V DC with an input voltage in the range 1.4 V DC to 5.5 V DC. Each device is capable of delivering up to 300 mA of output current. The TCR3LM offers a typical dropout voltage of 137mV. As the output voltage can be achieved with a lower input voltage, battery drain is reduced. Additionally, the load transient response has been improved, enhancing the output stability when the load fluctuates. The solution is housed in a DFN4D package measuring 1.0 mm × 1.0 mm × 0.37 mm. Furthermore, as small ceramic capacitors can be used on the input and output, the overall solution size is further reduced. | 30.05.2024 12:30:00 | May | news_2024-06-15_16.jpg | \images\news_2024-06-15_16.jpg | https://toshiba.semicon-storage.com/eu/company/news/2024/05/power-management-ics-20240530-1.html | toshiba.semicon-storage.com |